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US 12,399,006 B2Granted
Agitation monitoring system for plating process
AssigneeIntel Corporation
InventorsAdrian Bayraktaroglu, David Lampner, Darko Grujicic
Life of this patent
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Abstract
The present disclosure is directed to a monitoring system for a plating process using a monitoring device including a metrology component for collecting agitation intensity data on at least one agitation component within a plating equipment and transferring the collected agitation intensity data to a process control station.
Claims17
A monitoring system comprising:
- a plating equipment comprising a material flight bar, at least one agitation component that is configured to be mechanically agitated, and a monitoring device, the monitoring device being mounted on the agitation component and comprising:
- a metrology component configured to collect agitation intensity data,
- a microcontroller;
- a realtime connectivity component configured to transfer the collected agitation intensity data;
- and
- a power source;
- and
- a process control station configured to be coupled with the realtime connectivity component to receive the collected agitation intensity data.
5 more elements
A plating monitoring process comprising:
- providing a monitoring device and a plating equipment comprising a material flight bar and at least one agitation component;
- placing substrates into the plating equipment;
- performing plating process steps, wherein the plating process steps comprise:
- mechanically agitating the at least one agitation component and the monitoring device;
- collecting agitation intensity data using the monitoring device;
- and
- transferring the collected agitation intensity data to a process control station;
- wherein the monitoring device is mounted on the agitation component and comprises:
- a microcontroller,
- a metrology component,
- a power source;
- and
- a realtime connectivity component.
10 more elements
Dependencies are inferred from the claim text.