C23C 18/16
Chemical coating by decomposition of either liquid compounds or solutions of the
Official title: by reduction or substitution, e.g. electroless plating (C23C18/54 takes precedence)
C23C18/16 (Chemical coating by decomposition of either liquid compounds or solutions of the) appears on 4,282 US grants and 4,665 published applications in this corpus.
Search patents in C23C- Granted patents
- 4,282
- Published applications
- 4,665
- Assignees
- 1,872
- Inventors
- 10,009
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 62 | 0 |
| 1977 | 43 | 0 |
| 1978 | 52 | 0 |
| 1979 | 44 | 0 |
| 1980 | 44 | 0 |
| 1981 | 56 | 0 |
| 1982 | 57 | 0 |
| 1983 | 39 | 0 |
| 1984 | 45 | 0 |
| 1985 | 47 | 0 |
| 1986 | 57 | 0 |
| 1987 | 69 | 0 |
| 1988 | 52 | 0 |
| 1989 | 73 | 0 |
| 1990 | 65 | 0 |
| 1991 | 58 | 0 |
| 1992 | 55 | 0 |
| 1993 | 71 | 0 |
| 1994 | 64 | 0 |
| 1995 | 63 | 0 |
| 1996 | 55 | 0 |
| 1997 | 43 | 0 |
| 1998 | 50 | 0 |
| 1999 | 63 | 0 |
| 2000 | 60 | 0 |
| 2001 | 68 | 29 |
| 2002 | 72 | 86 |
| 2003 | 69 | 112 |
| 2004 | 100 | 186 |
| 2005 | 65 | 195 |
| 2006 | 68 | 181 |
| 2007 | 73 | 174 |
| 2008 | 49 | 170 |
| 2009 | 78 | 177 |
| 2010 | 100 | 199 |
| 2011 | 90 | 180 |
| 2012 | 120 | 170 |
| 2013 | 95 | 161 |
| 2014 | 132 | 225 |
| 2015 | 133 | 283 |
| 2016 | 162 | 348 |
| 2017 | 208 | 259 |
| 2018 | 195 | 230 |
| 2019 | 188 | 245 |
| 2020 | 167 | 237 |
| 2021 | 154 | 168 |
| 2022 | 138 | 170 |
| 2023 | 104 | 165 |
| 2024 | 107 | 137 |
| 2025 | 104 | 104 |
| 2026 | 56 | 74 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- System and method for performing localized electroless nickel plating6 Oct 2026US 12,753,513 B2Nuovo Pignone Tecnologie Srl
- Method for forming electroless plating electrode through selective cross-linking layer formation using laser6 Oct 2026US 12,753,514 B2Andong National University Industry-Academic Cooperation Foundation
- Electroless deposition process for semiconductor devices6 Oct 2026US 12,757,651 B2
- Substrate liquid processing method, and recording medium6 Oct 2026US 12,757,697 B2Tokyo Electron Limited
- Substrate liquid processing apparatus and substrate liquid processing method29 Sep 2026US 12,747,504 B2Tokyo Electron Limited
- Method for preparing non-electrically conductive antimicrobial articles17 Sep 2026US 2026/0275167 A1Eastman Kodak Company
- Method of training neural network model, and plating apparatus17 Sep 2026US 2026/0277174 A1Ebara Corporation
- Metal substrate and surface treatment method10 Sep 2026US 2026/0265919 A1National Tsing Hua University
- Laminate and method for manufacturing circuit board27 Aug 2026US 2026/0255493 A1Arisawa Mfg.Co., Ltd.
- Substrate liquid processing method and substrate liquid processing apparatus27 Aug 2026US 2026/0255892 A1Tokyo Electron Limited
Most cited
By later US patents
- Use of cobalt tungsten phosphide as a barrier material for copper metallization608US 5,695,810 ACornell Research Foundation, Inc. · 1997
- Seed layer deposition558US 6,824,665 B2Shipley Company, L.L.C. · 2004
- Chip interconnect and packaging deposition methods and structures556US 7,147,766 B2ASM Nutool, Inc. · 2006
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995