C23C 18/52
Using reducing agents for coating with metallic material not provided for in
Official title: using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
C23C18/52 (Using reducing agents for coating with metallic material not provided for in) appears on 120 US grants and 148 published applications in this corpus.
Search patents in C23C- Granted patents
- 120
- Published applications
- 148
- Assignees
- 116
- Inventors
- 418
- Latest grant
- 24 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 4 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 3 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 2 | 1 |
| 2003 | 1 | 5 |
| 2004 | 3 | 6 |
| 2005 | 2 | 2 |
| 2006 | 0 | 4 |
| 2007 | 3 | 3 |
| 2008 | 0 | 5 |
| 2009 | 2 | 2 |
| 2010 | 1 | 0 |
| 2011 | 1 | 5 |
| 2012 | 2 | 5 |
| 2013 | 2 | 9 |
| 2014 | 8 | 9 |
| 2015 | 6 | 11 |
| 2016 | 8 | 14 |
| 2017 | 5 | 11 |
| 2018 | 10 | 6 |
| 2019 | 6 | 9 |
| 2020 | 6 | 7 |
| 2021 | 2 | 2 |
| 2022 | 6 | 9 |
| 2023 | 2 | 8 |
| 2024 | 4 | 9 |
| 2025 | 4 | 2 |
| 2026 | 2 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wiring board, functional backplane, backlight module, display panel and display apparatus24 Feb 2026US 12,563,875 B2Boe Technology Group Co., Ltd.
- Method for producing layered product13 Jan 2026US 12,521,792 B2Sumitomo Chemical Company, Limited
- Catalyst solution for electroless plating devoid of an amine4 Nov 2025US 12,460,301 B2The Boeing Company
- Radio wave transmissive metallic member and method for manufacturing the same20 May 2025US 12,305,285 B2Toyota Jidosha Kabushiki Kaisha
- Plating stack11 Feb 2025US 12,221,699 B2Japan Pure Chemical Co., Ltd.
- Method of manufacturing nebuliser aperture plates25 Jun 2026US 2026/0176766 A1Stamford Devices Limited
- Wiring board, functional backplane, backlight module, display panel and display apparatus28 May 2026US 2026/0150451 A1Boe Technology Group Co., Ltd.
- Electroless plating solution12 Mar 2026US 2026/0071330 A1Napra Co., Ltd.
- Current collector, battery cell, and battery8 Jan 2026US 2026/0011881 A1Eve Energy Co., Ltd.
- Substrate processing method and substrate processing system13 Nov 2025US 2025/0347002 A1Tokyo Electron Limited
Most cited
By later US patents
- Process for electroless plating tin, lead or tin-lead alloy267US 5,248,527 AC. Uyemura & Co., Ltd. · 1993
- Controlled electroless plating254US 5,203,911 AShipley Company, L.L.C. · 1993
- Coated nanoparticles and quantum dots for solution-based fabrication of photovoltaic cells128US 7,306,823 B2Nanosolar, Inc. · 2007
- Electroless plating bath composition and method of using48US 6,645,567 B2Intel Corporation · 2003
- Process for forming zinc oxide film and processes for producing semiconductor device substrate and photo-electricity generating device using the film40US 6,106,689 ACanon Kabushiki Kaisha · 2000