Controlled electroless plating
AssigneeShipley Company, L.L.C.
InventorsPrasit Sricharoenchaikit, Gary S. Calabrese, Michael Gulla
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Abstract
A composition for electrolessly depositing thin metal coatings in selective patterns of fine dimension. The electroless plating solutions of the invention are characterized by a low metal content and preferably, freedom from alkali or alkaline earth metal ions.
Claims16
An aqueous electroless metal plating solution comprising a source of metal ions, a complexing agent for said metal ions, a reducing agent capable of reducing said metal ions to metallic form in the presence of a catalytic surface and a pH adjustor, said metal ions being present in a concentration ranging between about 0.001 and 0.01 moles per liter and said remaining solution components being present in solution in a concentration whereby the rate at which metal plates from solution does not exceed 100 Angstroms per minute.
An aqueous electroless nickel plating solution comprising a source of nickel ions, a complexing agent for said nickel ions, a reducing agent capable of reducing said nickel ions to metallic form in the presence of a catalytic surface and a pH adjustor, said nickel ions being present in a concentration ranging between about 0.001 and 0.01 moles per liter and said remaining solution components being present in solution in a concentration whereby the rate at which nickel plates from solution does not exceed 100 Angstroms per minute.
Dependencies are inferred from the claim text.