C23C 18/48
Coating with alloys
C23C18/48 (Coating with alloys) appears on 350 US grants and 440 published applications in this corpus.
Search patents in C23C- Granted patents
- 350
- Published applications
- 440
- Assignees
- 264
- Inventors
- 1,038
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 4 | 0 |
| 1978 | 4 | 0 |
| 1979 | 2 | 0 |
| 1980 | 5 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 5 | 0 |
| 1993 | 5 | 0 |
| 1994 | 5 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 6 | 0 |
| 2001 | 4 | 1 |
| 2002 | 3 | 8 |
| 2003 | 10 | 14 |
| 2004 | 13 | 22 |
| 2005 | 8 | 25 |
| 2006 | 7 | 26 |
| 2007 | 14 | 20 |
| 2008 | 11 | 16 |
| 2009 | 9 | 12 |
| 2010 | 10 | 7 |
| 2011 | 5 | 13 |
| 2012 | 7 | 11 |
| 2013 | 8 | 14 |
| 2014 | 7 | 19 |
| 2015 | 16 | 29 |
| 2016 | 17 | 38 |
| 2017 | 22 | 37 |
| 2018 | 29 | 21 |
| 2019 | 19 | 19 |
| 2020 | 9 | 18 |
| 2021 | 23 | 16 |
| 2022 | 5 | 19 |
| 2023 | 9 | 11 |
| 2024 | 10 | 6 |
| 2025 | 5 | 13 |
| 2026 | 3 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Apparatus and method for electroless surface finishing on glass15 Sep 2026US 12,740,460 B2Intel Corporation
- Method for blackening an electrical conduit28 Apr 2026US 12,615,011 B2Merlin Solar Technologies, Inc.
- Metallic coated substrates10 Mar 2026US 12,571,105 B2Armadillo Metal Coatings Ltd
- Semiconductor package23 Sep 2025US 12,426,164 B2Resonac Corporation
- Copper clad laminate and method for producing the same26 Aug 2025US 12,402,253 B2Toyo Kohan Co.Ltd
- Laminate and method for manufacturing circuit board27 Aug 2026US 2026/0255493 A1Arisawa Mfg.Co., Ltd.
- Electroless copper plating deposit, electroless copper plating bath, and method of producing electroless copper plating deposit6 Aug 2026US 2026/0226629 A1C. Uyemura & Co., Ltd.
- Method of manufacturing nebuliser aperture plates25 Jun 2026US 2026/0176766 A1Stamford Devices Limited
- Nickel plated steel sheet for battery case having excellent surface corrosion resistance and method for manufacturing28 May 2026US 2026/0149092 A1TCC Steel Corp.
- Electroless plating solution12 Mar 2026US 2026/0071330 A1Napra Co., Ltd.
Most cited
By later US patents
- Use of cobalt tungsten phosphide as a barrier material for copper metallization608US 5,695,810 ACornell Research Foundation, Inc. · 1997
- Cobalt-tin alloys and their applications for devices, chip interconnections and packaging316US 5,755,859 AInternational Business Machines Corporation · 1998
- Method of electroless plating copper on nitride barrier297US 6,436,816 B1Industrial Technology Research Institute · 2002
- Electroless nickel polyalloys269US 4,397,812 ARichardson Chemical Company · 1983
- Process for electroless plating tin, lead or tin-lead alloy267US 5,248,527 AC. Uyemura & Co., Ltd. · 1993