Semiconductor package
AssigneeResonac Corporation
InventorsMasaya Toba, Kazuhiko Kurafuchi, Takashi Masuko, Kazuyuki Mitsukura, Shinichiro Abe
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Abstract
A semiconductor package includes a wiring board and a semiconductor element mounted on the wiring board. The wiring board includes a first insulating material layer having a surface with an arithmetic average roughness Ra of 100 nm or less, a metal wiring provided on the surface of the first insulating material layer, and a second insulating material layer provided to cover the metal wiring. The metal wiring is configured by a metal layer in contact with the surface of the first insulating material layer and a conductive part stacked on a surface of the metal layer, and a nickel content rate of the metal layer is 0.25 to 20% by mass.
Claims8
A semiconductor package comprising:
- a wiring board;
- and
- a semiconductor element mounted on the wiring board;
- wherein the wiring board comprises:
- a first insulating material layer having a surface with an arithmetic average roughness Ra of 100 nm or less;
- a metal wiring provided on the surface of the first insulating material layer;
- and
- a second insulating material layer provided to cover the metal wiring, wherein
- the metal wiring is configured by a metal layer in contact with the surface of the first insulating material layer and a conductive part stacked on a surface of the metal layer, and
- a nickel content rate of the metal layer is 0.25 to 20% by mass.
Dependencies are inferred from the claim text.