Electroless copper plating deposit, electroless copper plating bath, and method of producing electroless copper plating deposit

Abstract

Provided are an electroless copper plating deposit that allows a metal oxide layer to exhibit good peel strength to a glass or ceramic material, and an electroless copper plating bath and a method of producing an electroless copper plating deposit, which are capable of producing the electroless copper plating deposit. Included is an electroless copper plating deposit which is formed on a metal oxide layer formed on a surface of a glass or ceramic material and which has a combined amount of nickel, cobalt, gold, silver, platinum, bismuth, antimony, tungsten, ruthenium, rhodium, lead, tellurium, iron, manganese, titanium, and vanadium that is 0.1% by mass or more.

Dependencies are inferred from the claim text.