C23C 18/31
Coating with metals
C23C18/31 (Coating with metals) appears on 2,186 US grants and 2,753 published applications in this corpus.
Search patents in C23C- Granted patents
- 2,186
- Published applications
- 2,753
- Assignees
- 1,256
- Inventors
- 6,113
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 20 | 0 |
| 1977 | 12 | 0 |
| 1978 | 13 | 0 |
| 1979 | 19 | 0 |
| 1980 | 14 | 0 |
| 1981 | 14 | 0 |
| 1982 | 22 | 0 |
| 1983 | 22 | 0 |
| 1984 | 18 | 0 |
| 1985 | 15 | 0 |
| 1986 | 25 | 0 |
| 1987 | 28 | 0 |
| 1988 | 15 | 0 |
| 1989 | 26 | 0 |
| 1990 | 30 | 0 |
| 1991 | 22 | 0 |
| 1992 | 24 | 0 |
| 1993 | 24 | 0 |
| 1994 | 21 | 0 |
| 1995 | 23 | 0 |
| 1996 | 21 | 0 |
| 1997 | 20 | 0 |
| 1998 | 22 | 0 |
| 1999 | 19 | 0 |
| 2000 | 27 | 0 |
| 2001 | 35 | 17 |
| 2002 | 43 | 47 |
| 2003 | 34 | 56 |
| 2004 | 54 | 93 |
| 2005 | 32 | 78 |
| 2006 | 35 | 77 |
| 2007 | 34 | 101 |
| 2008 | 24 | 103 |
| 2009 | 39 | 112 |
| 2010 | 48 | 114 |
| 2011 | 42 | 91 |
| 2012 | 63 | 79 |
| 2013 | 53 | 79 |
| 2014 | 60 | 114 |
| 2015 | 77 | 163 |
| 2016 | 88 | 220 |
| 2017 | 116 | 174 |
| 2018 | 126 | 138 |
| 2019 | 120 | 169 |
| 2020 | 111 | 154 |
| 2021 | 106 | 117 |
| 2022 | 87 | 112 |
| 2023 | 70 | 125 |
| 2024 | 73 | 91 |
| 2025 | 63 | 75 |
| 2026 | 37 | 54 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- System and method for performing localized electroless nickel plating6 Oct 2026US 12,753,513 B2Nuovo Pignone Tecnologie Srl
- Substrate liquid processing apparatus and substrate liquid processing method29 Sep 2026US 12,747,504 B2Tokyo Electron Limited
- Metal structural member used in cooperation with gallium-based liquid metal, manufacturing method therefor, and application thereof15 Sep 2026US 12,735,792 B2Yunnan Zhongxuan Liquid Metal Technology Co., Ltd
- Hydraulic devices including coated surfaces25 Aug 2026US 12,716,119 B2Maxterial, Inc.
- Method of making transparent composite articles21 Jul 2026US 12,686,198 B2Eastman Kodak Company
- Method for preparing non-electrically conductive antimicrobial articles17 Sep 2026US 2026/0275167 A1Eastman Kodak Company
- Metal substrate and surface treatment method10 Sep 2026US 2026/0265919 A1National Tsing Hua University
- Substrate liquid processing method and substrate liquid processing apparatus27 Aug 2026US 2026/0255892 A1Tokyo Electron Limited
- Thermoplastic resin composition, method of preparing thermoplastic resin composition, molded article including thermoplastic resin composition, and method of manufacturing molded article20 Aug 2026US 2026/0242585 A1LG Chem.Ltd.
- Methods of electrochemical deposition20 Aug 2026US 2026/0242969 A1
Most cited
By later US patents
- Use of cobalt tungsten phosphide as a barrier material for copper metallization608US 5,695,810 ACornell Research Foundation, Inc. · 1997
- Seed layer deposition558US 6,824,665 B2Shipley Company, L.L.C. · 2004
- Chip interconnect and packaging deposition methods and structures556US 7,147,766 B2ASM Nutool, Inc. · 2006
- Electroless deposition of metal films with spray processor361US 6,065,424 ACornell Research Foundation, Inc. · 2000
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997