C23C 18/38
Coating with copper
C23C18/38 (Coating with copper) appears on 786 US grants and 972 published applications in this corpus.
Search patents in C23C- Granted patents
- 786
- Published applications
- 972
- Assignees
- 488
- Inventors
- 2,346
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 6 | 0 |
| 1978 | 4 | 0 |
| 1979 | 6 | 0 |
| 1980 | 5 | 0 |
| 1981 | 7 | 0 |
| 1982 | 7 | 0 |
| 1983 | 7 | 0 |
| 1984 | 4 | 0 |
| 1985 | 8 | 0 |
| 1986 | 16 | 0 |
| 1987 | 21 | 0 |
| 1988 | 9 | 0 |
| 1989 | 12 | 0 |
| 1990 | 16 | 0 |
| 1991 | 10 | 0 |
| 1992 | 9 | 0 |
| 1993 | 6 | 0 |
| 1994 | 4 | 0 |
| 1995 | 10 | 0 |
| 1996 | 6 | 0 |
| 1997 | 6 | 0 |
| 1998 | 11 | 0 |
| 1999 | 3 | 0 |
| 2000 | 5 | 0 |
| 2001 | 9 | 5 |
| 2002 | 8 | 15 |
| 2003 | 14 | 16 |
| 2004 | 14 | 30 |
| 2005 | 6 | 25 |
| 2006 | 9 | 20 |
| 2007 | 13 | 25 |
| 2008 | 5 | 36 |
| 2009 | 13 | 24 |
| 2010 | 10 | 26 |
| 2011 | 12 | 19 |
| 2012 | 16 | 20 |
| 2013 | 16 | 22 |
| 2014 | 12 | 37 |
| 2015 | 27 | 76 |
| 2016 | 39 | 86 |
| 2017 | 54 | 81 |
| 2018 | 59 | 51 |
| 2019 | 43 | 75 |
| 2020 | 40 | 65 |
| 2021 | 46 | 45 |
| 2022 | 32 | 45 |
| 2023 | 20 | 40 |
| 2024 | 28 | 40 |
| 2025 | 23 | 26 |
| 2026 | 12 | 22 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Substrate liquid processing apparatus and substrate liquid processing method29 Sep 2026US 12,747,504 B2Tokyo Electron Limited
- Method of making transparent composite articles21 Jul 2026US 12,686,198 B2Eastman Kodak Company
- High-temperature resistant nano-copper produced by laser direct writing, preparation method and application thereof21 Jul 2026US 12,686,924 B2Zhejiang University
- Metallized polymer particles and related methods2 Jun 2026US 12,644,187 B2Xerox Corporation
- Copper clad laminate and method for producing the same14 Apr 2026US 12,604,417 B2Toyo Kohan Co.Ltd
- Method for preparing non-electrically conductive antimicrobial articles17 Sep 2026US 2026/0275167 A1Eastman Kodak Company
- Substrate having fine through-holes filled with metal and manufacturing method thereof13 Aug 2026US 2026/0233345 A1Tanigurogumi Corporation
- Ceramic plate, package, manufacturing method for ceramic plate, module, and electric or electronic product6 Aug 2026US 2026/0225963 A1Denka Company Limited
- A method for the pre-treatment of a surface of a substrate6 Aug 2026US 2026/0226628 A1Atotech Deutschland GmbH
- Electroless copper plating deposit, electroless copper plating bath, and method of producing electroless copper plating deposit6 Aug 2026US 2026/0226629 A1C. Uyemura & Co., Ltd.
Most cited
By later US patents
- Use of cobalt tungsten phosphide as a barrier material for copper metallization608US 5,695,810 ACornell Research Foundation, Inc. · 1997
- Seed layer deposition558US 6,824,665 B2Shipley Company, L.L.C. · 2004
- Electroless deposition of metal films with spray processor361US 6,065,424 ACornell Research Foundation, Inc. · 2000
- Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions278US 4,265,943 AMacDermid, Incorporated · 1981
- Alkaline free electroless deposition269US 5,240,497 ACornell Research Foundation, Inc. · 1993