Substrate having fine through-holes filled with metal and manufacturing method thereof
AssigneeTanigurogumi Corporation
InventorGenzo WATANABE
Life of this patent
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Abstract
A substrate having a plurality of fine through-holes filled with metal, comprising a conductive layer formed on an inner wall surface of each through-hole and a metal solder layer formed by solidification of a nickel-containing molten solder that has been treated with an organic fatty acid-containing solution. The conductive layer includes a copper plating layer on the metal solder layer side. An intermetallic compound layer that suppresses copper dissolution is formed at the interface between the copper plating layer and the metal solder layer. The substrate is preferably a glass or quartz substrate. Also provided is a manufacturing method thereof.
Claims21
A substrate comprising:
- a substrate body having a plurality of fine through-holes formed therein;
- each of the fine through-holes being filled with:
- (a) a conductive layer formed on an inner wall surface, the conductive layer including a copper plating layer on a side facing a metal solder layer;
- and
- (b) a metal solder layer disposed inside the conductive layer and formed by solidification of a nickel-containing molten solder treated with an organic fatty-acid-containing solution.
A method of manufacturing a substrate having a plurality of fine through-holes filled with metal, the method comprising:
- forming a conductive layer on an inner wall surface of each of the fine through-holes in a substrate body, the conductive layer composed of a copper plating layer or a copper alloy plating layer;
- and
- supplying a liquid flow of a nickel-containing molten solder that has been treated with an organic fatty acid-containing solution onto the conductive layer on the inner wall surface to fill the fine through-hole with the metal solder layer,
- such that each of the fine through-holes is filled with the conductive layer and the metal solder layer.
Dependencies are inferred from the claim text.