C23C 18/40
Using reducing agents
Official title: using reducing agents
C23C18/40 (Using reducing agents) appears on 440 US grants and 484 published applications in this corpus.
Search patents in C23C- Granted patents
- 440
- Published applications
- 484
- Assignees
- 278
- Inventors
- 1,301
- Latest grant
- 21 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 6 | 0 |
| 1978 | 4 | 0 |
| 1979 | 6 | 0 |
| 1980 | 4 | 0 |
| 1981 | 6 | 0 |
| 1982 | 5 | 0 |
| 1983 | 5 | 0 |
| 1984 | 3 | 0 |
| 1985 | 8 | 0 |
| 1986 | 10 | 0 |
| 1987 | 15 | 0 |
| 1988 | 7 | 0 |
| 1989 | 7 | 0 |
| 1990 | 12 | 0 |
| 1991 | 6 | 0 |
| 1992 | 4 | 0 |
| 1993 | 4 | 0 |
| 1994 | 3 | 0 |
| 1995 | 6 | 0 |
| 1996 | 3 | 0 |
| 1997 | 6 | 0 |
| 1998 | 8 | 0 |
| 1999 | 1 | 0 |
| 2000 | 5 | 0 |
| 2001 | 7 | 2 |
| 2002 | 5 | 10 |
| 2003 | 10 | 8 |
| 2004 | 8 | 19 |
| 2005 | 5 | 23 |
| 2006 | 5 | 15 |
| 2007 | 9 | 13 |
| 2008 | 3 | 22 |
| 2009 | 9 | 18 |
| 2010 | 6 | 20 |
| 2011 | 9 | 15 |
| 2012 | 11 | 16 |
| 2013 | 12 | 9 |
| 2014 | 8 | 17 |
| 2015 | 16 | 34 |
| 2016 | 21 | 47 |
| 2017 | 25 | 38 |
| 2018 | 28 | 16 |
| 2019 | 18 | 27 |
| 2020 | 15 | 20 |
| 2021 | 13 | 20 |
| 2022 | 12 | 21 |
| 2023 | 10 | 20 |
| 2024 | 10 | 17 |
| 2025 | 10 | 10 |
| 2026 | 6 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- High-temperature resistant nano-copper produced by laser direct writing, preparation method and application thereof21 Jul 2026US 12,686,924 B2Zhejiang University
- Copper clad laminate and method for producing the same14 Apr 2026US 12,604,417 B2Toyo Kohan Co.Ltd
- Catalyst ink for plating and electroless plating method using same10 Feb 2026US 12,545,799 B2Korea Electrotechnology Research Institute
- Stable composition for catalytic deposition of silver3 Feb 2026US 12,540,403 B2Swissto12 SA
- Leveling agent and electrolytic composition for filling via hole13 Jan 2026US 12,522,559 B2Ymt Co., Ltd.
- Substrate having fine through-holes filled with metal and manufacturing method thereof13 Aug 2026US 2026/0233345 A1Tanigurogumi Corporation
- A method for the pre-treatment of a surface of a substrate6 Aug 2026US 2026/0226628 A1Atotech Deutschland GmbH
- Chromium acid etching free metal plating of blends of acrylonitrile-butadiene-styrene and polar polymer16 Jul 2026US 2026/0201157 A1Sabic Global Technologies B.V.
- Method for providing a conductive surface on a non-conductive polymeric surface19 Mar 2026US 2026/0078495 A1Cirrus Materials Science Ltd
- Composite substrate for all-solid-state battery and all-solid-state battery including the same19 Feb 2026US 2026/0051575 A1Samsung SDI.Co., Ltd.
Most cited
By later US patents
- Use of cobalt tungsten phosphide as a barrier material for copper metallization608US 5,695,810 ACornell Research Foundation, Inc. · 1997
- Seed layer deposition558US 6,824,665 B2Shipley Company, L.L.C. · 2004
- Electroless deposition of metal films with spray processor361US 6,065,424 ACornell Research Foundation, Inc. · 2000
- Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions278US 4,265,943 AMacDermid, Incorporated · 1981
- Alkaline free electroless deposition269US 5,240,497 ACornell Research Foundation, Inc. · 1993