C23C 18/405
Formaldehyde
Official title: {Formaldehyde}
C23C18/405 (Formaldehyde) appears on 179 US grants and 213 published applications in this corpus.
Search patents in C23C- Granted patents
- 179
- Published applications
- 213
- Assignees
- 150
- Inventors
- 661
- Latest grant
- 13 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 4 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 1 | 0 |
| 1985 | 4 | 0 |
| 1986 | 5 | 0 |
| 1987 | 5 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 6 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 2 | 0 |
| 2002 | 3 | 4 |
| 2003 | 2 | 3 |
| 2004 | 3 | 7 |
| 2005 | 0 | 14 |
| 2006 | 1 | 9 |
| 2007 | 4 | 4 |
| 2008 | 2 | 6 |
| 2009 | 2 | 9 |
| 2010 | 4 | 11 |
| 2011 | 5 | 5 |
| 2012 | 6 | 7 |
| 2013 | 5 | 3 |
| 2014 | 2 | 5 |
| 2015 | 8 | 13 |
| 2016 | 7 | 23 |
| 2017 | 8 | 12 |
| 2018 | 8 | 9 |
| 2019 | 10 | 13 |
| 2020 | 7 | 11 |
| 2021 | 6 | 11 |
| 2022 | 7 | 10 |
| 2023 | 6 | 9 |
| 2024 | 3 | 6 |
| 2025 | 4 | 5 |
| 2026 | 1 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Methods for treating metal nanocrystals and for forming bulk nanostructured metal alloys13 Jan 2026US 12,522,928 B2Northwestern University
- Agitation monitoring system for plating process26 Aug 2025US 12,399,006 B2Intel Corporation
- Methodology for coating non-conducting articles with broad-spectrum antimicrobial electroless plating layers5 Aug 2025US 12,378,672 B2
- Structure with conductive pattern and method for manufacturing same29 Jul 2025US 12,376,230 B2Asahi Kasei Kabushiki Kaisha
- Method for selective metallisation of inorganic dielectrics or semiconductors17 Jun 2025US 12,336,114 B2Valstybinis Moksliniu Tyrimu Institutas Fiziniu Ir Technologijos Mokslu Centras
- Substrate having fine through-holes filled with metal and manufacturing method thereof13 Aug 2026US 2026/0233345 A1Tanigurogumi Corporation
- Chromium acid etching free metal plating of blends of acrylonitrile-butadiene-styrene and polar polymer16 Jul 2026US 2026/0201157 A1Sabic Global Technologies B.V.
- Method for providing a conductive surface on a non-conductive polymeric surface19 Mar 2026US 2026/0078495 A1Cirrus Materials Science Ltd
- Metal Plating of 3D Objects Printed with Catalyst Precursor Resin29 Jan 2026US 2026/0027769 A1Elektrum Technologies, Inc.
- Thermoplastic composition for metal plating9 Oct 2025US 2025/0313689 A1Sabic Global Technologies B.V.
Most cited
By later US patents
- Use of cobalt tungsten phosphide as a barrier material for copper metallization608US 5,695,810 ACornell Research Foundation, Inc. · 1997
- Seed layer deposition558US 6,824,665 B2Shipley Company, L.L.C. · 2004
- Electroless deposition of metal films with spray processor361US 6,065,424 ACornell Research Foundation, Inc. · 2000
- Method for planarized interconnect vias using electroless plating and CMP263US 6,136,693 AChartered Semiconductor Manufacturing Ltd. · 2000
- Method of metallizing high aspect ratio apertures124US 5,576,052 AMotorola, Inc. · 1996