C23C 18/42
Coating with noble metals
C23C18/42 (Coating with noble metals) appears on 633 US grants and 762 published applications in this corpus.
Search patents in C23C- Granted patents
- 633
- Published applications
- 762
- Assignees
- 489
- Inventors
- 1,941
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 2 | 0 |
| 1978 | 6 | 0 |
| 1979 | 6 | 0 |
| 1980 | 3 | 0 |
| 1981 | 5 | 0 |
| 1982 | 6 | 0 |
| 1983 | 3 | 0 |
| 1984 | 5 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 6 | 0 |
| 1988 | 2 | 0 |
| 1989 | 9 | 0 |
| 1990 | 10 | 0 |
| 1991 | 5 | 0 |
| 1992 | 7 | 0 |
| 1993 | 10 | 0 |
| 1994 | 10 | 0 |
| 1995 | 6 | 0 |
| 1996 | 3 | 0 |
| 1997 | 8 | 0 |
| 1998 | 5 | 0 |
| 1999 | 9 | 0 |
| 2000 | 3 | 0 |
| 2001 | 13 | 6 |
| 2002 | 17 | 14 |
| 2003 | 7 | 21 |
| 2004 | 18 | 24 |
| 2005 | 8 | 19 |
| 2006 | 7 | 14 |
| 2007 | 7 | 22 |
| 2008 | 6 | 20 |
| 2009 | 6 | 31 |
| 2010 | 11 | 34 |
| 2011 | 15 | 30 |
| 2012 | 21 | 30 |
| 2013 | 17 | 26 |
| 2014 | 24 | 43 |
| 2015 | 29 | 46 |
| 2016 | 33 | 70 |
| 2017 | 34 | 47 |
| 2018 | 36 | 31 |
| 2019 | 40 | 43 |
| 2020 | 28 | 46 |
| 2021 | 28 | 31 |
| 2022 | 24 | 31 |
| 2023 | 16 | 29 |
| 2024 | 22 | 19 |
| 2025 | 20 | 24 |
| 2026 | 9 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Substrate liquid processing apparatus and substrate liquid processing method29 Sep 2026US 12,747,504 B2Tokyo Electron Limited
- Electroless ruthenium plating bath14 Jul 2026US 12,680,170 B2C. Uyemura & Co., Ltd.
- Composition for depositing a palladium coating on a substrate23 Jun 2026US 12,662,738 B2Atotech Deutschland GmbH
- Power component submount and manufacturing method thereof23 Jun 2026US 12,666,542 B2Tong Hsing Electronic Industries, Ltd.
- Composition for depositing a palladium coating on a substrate16 Jun 2026US 12,655,525 B2Atotech Deutschland GmbH
- Metal substrate and surface treatment method10 Sep 2026US 2026/0265919 A1National Tsing Hua University
- Methods of electrochemical deposition20 Aug 2026US 2026/0242969 A1
- Plated material and plating pretreatment method30 Jul 2026US 2026/0218382 A1Yazaki Corporation
- Plating bath composition for plating of precious metal and a method for depositing a precious metal layer23 Jul 2026US 2026/0209945 A1Atotech Deutschland GmbH
- Resin material treatment method, and compositions for the same25 Jun 2026US 2026/0176767 A1Okuno Chemical Industries Co., Ltd.
Most cited
By later US patents
- Selective metallization process265US 5,510,216 AShipley Company, L.L.C. · 1996
- Method for forming Co-W-P-Au films259US 6,323,128 B1International Business Machines Corporation · 2001
- Electroless nickel plating solution and method255US 5,910,340 AC. Uyemura & Co., Ltd. · 1999
- Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device164US 5,645,628 AMatsushita Electric Industrial Co., Ltd. · 1997
- Method for producing electroless barrier layer and solder bump on chip104US 5,583,073 ANational Science Council · 1996