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US 12,662,738 B2Granted
Composition for depositing a palladium coating on a substrate
AssigneeAtotech Deutschland GmbH
InventorsDonny Lautan, Dimitri Voloshyn, Isabel-Roda Hirsekorn, Dirk Tews
Life of this patent
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Abstract
The present invention is directed to a composition for depositing a palladium coating on an activated copper-coated substrate, the composition comprising: (i) palladium ions, (ii) chloride ions, (iii) ethylenediamine (EDA), (iv) ethylenediamine disuccinate (EDDS), and (v) at least one reducing agent, wherein the composition has a pH in a range from 7.5 to 9.5, preferably from 7.6 to 9.1, more preferably from 7.7 to 8.7, and most preferably from 7.8 to 8.5.
Claims10
A composition for depositing a palladium coating on an activated copper-coated substrate, the composition comprising:
- (i) palladium ions,
- (ii) chloride ions,
- (iii) ethylenediamine (EDA),
- (iv) ethylenediamine disuccinate (EDDS), and
- (v) at least one reducing agent,
- wherein the composition has a pH in a range from 7.5 to 9.5,
- wherein the composition comprises the palladium ions in a total concentration in a range from 0.3 g/L to 2.0 g/L, based on the total volume of the composition, and wherein in the composition the ratio of palladium ions to ethylenediamine (EDA) is from 1:3 to 1:5.
4 more elements
Dependencies are inferred from the claim text.