C23C 18/44
Using reducing agents
Official title: using reducing agents
C23C18/44 (Using reducing agents) appears on 379 US grants and 442 published applications in this corpus.
Search patents in C23C- Granted patents
- 379
- Published applications
- 442
- Assignees
- 314
- Inventors
- 1,166
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 4 | 0 |
| 1979 | 6 | 0 |
| 1980 | 1 | 0 |
| 1981 | 5 | 0 |
| 1982 | 6 | 0 |
| 1983 | 2 | 0 |
| 1984 | 3 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 8 | 0 |
| 1990 | 8 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 6 | 0 |
| 1994 | 7 | 0 |
| 1995 | 4 | 0 |
| 1996 | 2 | 0 |
| 1997 | 8 | 0 |
| 1998 | 4 | 0 |
| 1999 | 5 | 0 |
| 2000 | 2 | 0 |
| 2001 | 7 | 2 |
| 2002 | 12 | 9 |
| 2003 | 5 | 13 |
| 2004 | 11 | 15 |
| 2005 | 4 | 15 |
| 2006 | 5 | 10 |
| 2007 | 3 | 14 |
| 2008 | 4 | 10 |
| 2009 | 3 | 23 |
| 2010 | 5 | 17 |
| 2011 | 8 | 23 |
| 2012 | 16 | 18 |
| 2013 | 12 | 17 |
| 2014 | 11 | 24 |
| 2015 | 20 | 36 |
| 2016 | 24 | 41 |
| 2017 | 20 | 19 |
| 2018 | 21 | 12 |
| 2019 | 18 | 16 |
| 2020 | 11 | 27 |
| 2021 | 16 | 15 |
| 2022 | 8 | 16 |
| 2023 | 9 | 21 |
| 2024 | 14 | 11 |
| 2025 | 12 | 12 |
| 2026 | 4 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electroless ruthenium plating bath14 Jul 2026US 12,680,170 B2C. Uyemura & Co., Ltd.
- Composition for depositing a palladium coating on a substrate16 Jun 2026US 12,655,525 B2Atotech Deutschland GmbH
- Stable composition for catalytic deposition of silver3 Feb 2026US 12,540,403 B2Swissto12 SA
- Method for producing layered product13 Jan 2026US 12,521,792 B2Sumitomo Chemical Company, Limited
- Method of producing catalyst, catalyst, and fuel cell23 Dec 2025US 12,506,157 B2Toyota Boshoku Kabushiki Kaisha
- Metal substrate and surface treatment method10 Sep 2026US 2026/0265919 A1National Tsing Hua University
- Plating bath composition for plating of precious metal and a method for depositing a precious metal layer23 Jul 2026US 2026/0209945 A1Atotech Deutschland GmbH
- Triple core-shell catalyst complex for electrochemical device and method of manufacturing same28 May 2026US 2026/0149006 A1Hyundai Motor Company
- Phosphorus free electroless palladium23 Apr 2026US 2026/0110094 A1
- Electroless ruthenium plating bath26 Mar 2026US 2026/0085426 A1C. Uyemura & Co., Ltd.
Most cited
By later US patents
- Method for forming Co-W-P-Au films259US 6,323,128 B1International Business Machines Corporation · 2001
- Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device164US 5,645,628 AMatsushita Electric Industrial Co., Ltd. · 1997
- Method for producing electroless barrier layer and solder bump on chip104US 5,583,073 ANational Science Council · 1996
- Method for fabrication of metallized medical devices67US 5,685,961 AP & D Medical Coatings, Inc. · 1997
- Deposition of an extremely thin silver layer on a nonconducting substrate57US 5,320,908 AAd Tech Holdings Limited · 1994