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US 12,680,170 B2Granted
Electroless ruthenium plating bath
AssigneeC. Uyemura & Co., Ltd.
InventorsYoshihito II, Yoichi Maruo, Yukinori Oda
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Abstract
An electroless ruthenium plating bath at least contains: a ruthenium compound; a reducing agent; and a stabilizer. The reducing agent is at least one of an amine borane compound or sodium hypophosphite. The stabilizer is made of a hydroxylamine compound and an amine compound. The hydroxylamine compound is at least one of hydroxylamine sulfate or hydroxylamine chloride.
Claims6
An electroless ruthenium plating bath at least comprising:
- a ruthenium compound;
- a reducing agent;
- and a stabilizer,
- the reducing agent being at least one of an amine borane compound or sodium hypophosphite,
- the stabilizer being a combination of a hydroxylamine compound and an amine compound,
- the hydroxylamine compound being at least one of hydroxylamine sulfate or hydroxylamine chloride.
3 more elements
Dependencies are inferred from the claim text.