Resin material treatment method, and compositions for the same
AssigneeOkuno Chemical Industries Co., Ltd.
InventorsShingo Nagamine, Koji Kita
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Abstract
The present invention provides a pretreatment composition for electroless plating, a pretreatment method, and an electroless plating method that exhibit high plating deposition performance without using harmful chromic acid and expensive palladium, while reducing the number of steps. The present invention provides a pretreatment composition for electroless plating that contains 10 mg/L or more of manganese ions and 10 mg/L or more of monovalent silver ions.
Claims3
A composition for pretreating a resin material, the composition comprising 10 mg/L or more of manganese ions and 10 mg/L or more of monovalent silver ions.
Dependencies are inferred from the claim text.