C23C 18/32
Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
Official title: Coating with nickel, cobalt or mixtures thereof with phosphorus or boron (C23C18/50 takes precedence)
C23C18/32 (Coating with nickel, cobalt or mixtures thereof with phosphorus or boron) appears on 928 US grants and 1,277 published applications in this corpus.
Search patents in C23C- Granted patents
- 928
- Published applications
- 1,277
- Assignees
- 661
- Inventors
- 2,888
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 10 | 0 |
| 1977 | 5 | 0 |
| 1978 | 3 | 0 |
| 1979 | 6 | 0 |
| 1980 | 5 | 0 |
| 1981 | 1 | 0 |
| 1982 | 6 | 0 |
| 1983 | 13 | 0 |
| 1984 | 8 | 0 |
| 1985 | 4 | 0 |
| 1986 | 12 | 0 |
| 1987 | 9 | 0 |
| 1988 | 7 | 0 |
| 1989 | 8 | 0 |
| 1990 | 5 | 0 |
| 1991 | 7 | 0 |
| 1992 | 12 | 0 |
| 1993 | 11 | 0 |
| 1994 | 5 | 0 |
| 1995 | 8 | 0 |
| 1996 | 8 | 0 |
| 1997 | 6 | 0 |
| 1998 | 7 | 0 |
| 1999 | 7 | 0 |
| 2000 | 13 | 0 |
| 2001 | 10 | 8 |
| 2002 | 14 | 20 |
| 2003 | 19 | 32 |
| 2004 | 28 | 45 |
| 2005 | 16 | 35 |
| 2006 | 15 | 35 |
| 2007 | 14 | 43 |
| 2008 | 14 | 37 |
| 2009 | 15 | 43 |
| 2010 | 22 | 34 |
| 2011 | 17 | 29 |
| 2012 | 21 | 33 |
| 2013 | 14 | 36 |
| 2014 | 16 | 56 |
| 2015 | 30 | 71 |
| 2016 | 46 | 110 |
| 2017 | 48 | 88 |
| 2018 | 53 | 66 |
| 2019 | 58 | 95 |
| 2020 | 53 | 72 |
| 2021 | 52 | 56 |
| 2022 | 38 | 61 |
| 2023 | 36 | 71 |
| 2024 | 45 | 44 |
| 2025 | 28 | 35 |
| 2026 | 20 | 22 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- System and method for performing localized electroless nickel plating6 Oct 2026US 12,753,513 B2Nuovo Pignone Tecnologie Srl
- Substrate liquid processing apparatus and substrate liquid processing method29 Sep 2026US 12,747,504 B2Tokyo Electron Limited
- Metal structural member used in cooperation with gallium-based liquid metal, manufacturing method therefor, and application thereof15 Sep 2026US 12,735,792 B2Yunnan Zhongxuan Liquid Metal Technology Co., Ltd
- Hydraulic devices including coated surfaces25 Aug 2026US 12,716,119 B2Maxterial, Inc.
- Power component submount and manufacturing method thereof23 Jun 2026US 12,666,542 B2Tong Hsing Electronic Industries, Ltd.
- Substrate liquid processing method and substrate liquid processing apparatus27 Aug 2026US 2026/0255892 A1Tokyo Electron Limited
- Thermoplastic resin composition, method of preparing thermoplastic resin composition, molded article including thermoplastic resin composition, and method of manufacturing molded article20 Aug 2026US 2026/0242585 A1LG Chem.Ltd.
- Steel sheet13 Aug 2026US 2026/0234766 A1Nippon Steel Corporation
- Ceramic plate, package, manufacturing method for ceramic plate, module, and electric or electronic product6 Aug 2026US 2026/0225963 A1Denka Company Limited
- Nickel-plated metal material6 Aug 2026US 2026/0226644 A1Toyo Kohan Co.Ltd
Most cited
By later US patents
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997
- Method of electroless plating copper on nitride barrier297US 6,436,816 B1Industrial Technology Research Institute · 2002
- Palladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal deposition270US 5,380,560 AInternational Business Machines Corporation · 1995
- Alkaline free electroless deposition269US 5,240,497 ACornell Research Foundation, Inc. · 1993
- Selective metallization process265US 5,510,216 AShipley Company, L.L.C. · 1996