C23C 18/34
Using reducing agents
Official title: using reducing agents
C23C18/34 (Using reducing agents) appears on 495 US grants and 610 published applications in this corpus.
Search patents in C23C- Granted patents
- 495
- Published applications
- 610
- Assignees
- 364
- Inventors
- 1,475
- Latest grant
- 2 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 9 | 0 |
| 1977 | 5 | 0 |
| 1978 | 3 | 0 |
| 1979 | 6 | 0 |
| 1980 | 4 | 0 |
| 1981 | 0 | 0 |
| 1982 | 6 | 0 |
| 1983 | 11 | 0 |
| 1984 | 6 | 0 |
| 1985 | 3 | 0 |
| 1986 | 7 | 0 |
| 1987 | 6 | 0 |
| 1988 | 5 | 0 |
| 1989 | 5 | 0 |
| 1990 | 4 | 0 |
| 1991 | 4 | 0 |
| 1992 | 5 | 0 |
| 1993 | 8 | 0 |
| 1994 | 5 | 0 |
| 1995 | 4 | 0 |
| 1996 | 5 | 0 |
| 1997 | 4 | 0 |
| 1998 | 5 | 0 |
| 1999 | 5 | 0 |
| 2000 | 11 | 0 |
| 2001 | 8 | 5 |
| 2002 | 10 | 12 |
| 2003 | 11 | 20 |
| 2004 | 19 | 32 |
| 2005 | 13 | 24 |
| 2006 | 6 | 22 |
| 2007 | 10 | 28 |
| 2008 | 8 | 22 |
| 2009 | 11 | 14 |
| 2010 | 12 | 18 |
| 2011 | 8 | 15 |
| 2012 | 10 | 18 |
| 2013 | 9 | 16 |
| 2014 | 5 | 29 |
| 2015 | 17 | 41 |
| 2016 | 26 | 46 |
| 2017 | 21 | 38 |
| 2018 | 22 | 23 |
| 2019 | 22 | 40 |
| 2020 | 22 | 32 |
| 2021 | 22 | 24 |
| 2022 | 15 | 30 |
| 2023 | 17 | 31 |
| 2024 | 17 | 10 |
| 2025 | 10 | 9 |
| 2026 | 8 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Metallized polymer particles and related methods2 Jun 2026US 12,644,187 B2Xerox Corporation
- Low friction coating for melt blown die and preparation method for coating31 Mar 2026US 12,590,037 B2Taizhou Clean Carbon Technology Co., Ltd.
- Metallic coated substrates10 Mar 2026US 12,571,105 B2Armadillo Metal Coatings Ltd
- Pinion shaft, watch mechanism, watch or measurement device without a magnetic signature3 Mar 2026US 12,565,711 B2Omega SA
- Bendable nickel plating on flexible substrates17 Feb 2026US 12,553,134 B2MacDermid Enthone Inc.
- Substrate liquid processing method and substrate liquid processing apparatus27 Aug 2026US 2026/0255892 A1Tokyo Electron Limited
- Nickel-plated metal material6 Aug 2026US 2026/0226644 A1Toyo Kohan Co.Ltd
- Chromium acid etching free metal plating of blends of acrylonitrile-butadiene-styrene and polar polymer16 Jul 2026US 2026/0201157 A1Sabic Global Technologies B.V.
- Hard film formed body, machine component, and bearing2 Jul 2026US 2026/0185562 A1Ntn Corporation
- Method of manufacturing nebuliser aperture plates25 Jun 2026US 2026/0176766 A1Stamford Devices Limited
Most cited
By later US patents
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997
- Method of electroless plating copper on nitride barrier297US 6,436,816 B1Industrial Technology Research Institute · 2002
- Alkaline free electroless deposition269US 5,240,497 ACornell Research Foundation, Inc. · 1993
- Electroless plating liquid and semiconductor device258US 6,717,189 B2Ebara Corporation · 2004
- Production of electroless Co(P) with designed coercivity256US 6,197,364 B1International Business Machines Corporation · 2001