C23C 18/18
Pretreatment of the material to be coated
C23C18/18 (Pretreatment of the material to be coated) appears on 1,942 US grants and 2,150 published applications in this corpus.
Search patents in C23C- Granted patents
- 1,942
- Published applications
- 2,150
- Assignees
- 1,001
- Inventors
- 4,929
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 38 | 0 |
| 1977 | 27 | 0 |
| 1978 | 30 | 0 |
| 1979 | 20 | 0 |
| 1980 | 20 | 0 |
| 1981 | 31 | 0 |
| 1982 | 28 | 0 |
| 1983 | 18 | 0 |
| 1984 | 25 | 0 |
| 1985 | 26 | 0 |
| 1986 | 35 | 0 |
| 1987 | 36 | 0 |
| 1988 | 30 | 0 |
| 1989 | 42 | 0 |
| 1990 | 33 | 0 |
| 1991 | 35 | 0 |
| 1992 | 29 | 0 |
| 1993 | 37 | 0 |
| 1994 | 31 | 0 |
| 1995 | 39 | 0 |
| 1996 | 28 | 0 |
| 1997 | 20 | 0 |
| 1998 | 17 | 0 |
| 1999 | 30 | 0 |
| 2000 | 21 | 0 |
| 2001 | 25 | 12 |
| 2002 | 27 | 33 |
| 2003 | 25 | 49 |
| 2004 | 33 | 79 |
| 2005 | 24 | 97 |
| 2006 | 25 | 85 |
| 2007 | 31 | 93 |
| 2008 | 22 | 74 |
| 2009 | 33 | 101 |
| 2010 | 39 | 95 |
| 2011 | 40 | 89 |
| 2012 | 59 | 67 |
| 2013 | 43 | 65 |
| 2014 | 63 | 87 |
| 2015 | 61 | 142 |
| 2016 | 71 | 170 |
| 2017 | 84 | 115 |
| 2018 | 92 | 96 |
| 2019 | 79 | 140 |
| 2020 | 72 | 110 |
| 2021 | 77 | 77 |
| 2022 | 54 | 77 |
| 2023 | 46 | 66 |
| 2024 | 38 | 57 |
| 2025 | 36 | 47 |
| 2026 | 17 | 27 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- System and method for performing localized electroless nickel plating6 Oct 2026US 12,753,513 B2Nuovo Pignone Tecnologie Srl
- Apparatus and method for electroless surface finishing on glass15 Sep 2026US 12,740,460 B2Intel Corporation
- Substrate liquid processing method and substrate liquid processing apparatus14 Jul 2026US 12,680,169 B2Tokyo Electron Limited
- Metallized polymer particles and related methods2 Jun 2026US 12,644,187 B2Xerox Corporation
- Method for blackening an electrical conduit28 Apr 2026US 12,615,011 B2Merlin Solar Technologies, Inc.
- Method for preparing non-electrically conductive antimicrobial articles17 Sep 2026US 2026/0275167 A1Eastman Kodak Company
- Substrate liquid processing method and substrate liquid processing apparatus27 Aug 2026US 2026/0255892 A1Tokyo Electron Limited
- Thermoplastic resin composition, method of preparing thermoplastic resin composition, molded article including thermoplastic resin composition, and method of manufacturing molded article20 Aug 2026US 2026/0242585 A1LG Chem.Ltd.
- Laminated structure and method for manufacturing the same20 Aug 2026US 2026/0242973 A1Murata Manufacturing Co., Ltd.
- Ceramic plate, package, manufacturing method for ceramic plate, module, and electric or electronic product6 Aug 2026US 2026/0225963 A1Denka Company Limited
Most cited
By later US patents
- Chip interconnect and packaging deposition methods and structures556US 7,147,766 B2ASM Nutool, Inc. · 2006
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999
- Vacuum-integrated hardmask processes and apparatus389US 9,778,561 B2Lam Research Corporation · 2017
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997
- Catalyst for electroless deposition of metals274US 3,937,857 AAMP Incorporated · 1976