Substrate liquid processing method and substrate liquid processing apparatus

A substrate liquid processing method, comprising:

• preparing a substrate including a recess and a wiring exposed at a bottom of the recess;
• forming a self-assembled monolayer on a side wall of the recess;
• attaching an intermolecular binder, which is allowed to be bonded to both a metal and the self-assembled monolayer, to the self-assembled monolayer;
• burying, by supplying an electroless plating solution to the recess in a state where the intermolecular binder is attached to the self-assembled monolayer to precipitate the metal in the recess, the metal in the recess while bringing the metal into contact with the intermolecular binder;
• heating the self-assembled monolayer on the side wall of the recess at a first temperature before attaching the intermolecular binder to the self-assembled monolayer;
• removing a part of the self-assembled monolayer from the side wall of the recess after heating the self-assembled monolayer at the first temperature and before attaching the intermolecular binder to the self-assembled monolayer;
• and
• heating the self-assembled monolayer on the side wall of the recess at a second temperature, which is higher than the first temperature, after removing the part of the self-assembled monolayer from the side wall of the recess and before attaching the intermolecular binder to the self-assembled monolayer,
• wherein the first temperature promotes bonding between the side wall of the recess and the self-assembled monolayer while suppressing completion of a curing reaction throughout the self-assembled monolayer, and
• wherein the second temperature increases reactivity of the self-assembled monolayer to the intermolecular binder while suppressing completion of a curing reaction throughout the self-assembled monolayer.