Substrate liquid processing apparatus and substrate liquid processing method
AssigneeTokyo Electron Limited
InventorsMitsuaki Iwashita, Takeshi Nagao
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Abstract
A technique advantageous for shortening time required for electroless plating that is performed on a substrate is provided. A substrate liquid processing apparatus includes a substrate holder configured to hold the substrate; a reaction acceleration unit, configured to accelerate a plating reaction of an unused electroless plating solution, including an activation unit configured to accelerate the electroless plating solution with respect to the plating reaction and a reaction heater configured to heat the electroless plating solution; and a plating solution supply configured to supply the electroless plating solution to the substrate held by the substrate holder.
Claims11
A substrate liquid processing apparatus, comprising:
- a substrate holder configured to hold a substrate;
- a reaction acceleration unit, configured to accelerate a plating reaction of an unused electroless plating solution, including an activation unit configured to accelerate the electroless plating solution with respect to the plating reaction and a reaction heater configured to heat the electroless plating solution;
- and
- a plating solution supply configured to supply the electroless plating solution to the substrate held by the substrate holder,
- wherein the activation unit has a catalyst contact unit configured to activate the electroless plating solution with respect to the plating reaction by bringing a catalyst member into contact with the electroless plating solution.
Dependencies are inferred from the claim text.