Method of fabricating semiconductor device using apparatus for supplying supercritical fluids

A method of fabricating a semiconductor device, the method comprising:

• providing a substrate to an inside of a chamber, wherein the substrate is coated with a first fluid;
• providing a first supercritical fluid to the inside of the chamber through a lower inlet formed in a lower wall of the chamber;
• storing a second fluid formed by a mixture of the first fluid and the first supercritical fluid inside a drain cup placed between the lower wall of the chamber and the substrate;
• providing a second supercritical fluid to the inside of the chamber through an upper inlet formed in an upper wall of the chamber;
• and
• discharging the second fluid stored in the drain cup to the outside of the chamber through a fluid outlet formed in the lower wall of the chamber,
• wherein the drain cup includes a first portion of which a width, in a horizontal direction, decreases toward the lower wall of the chamber, and a second portion which connects the first portion and the fluid outlet to each other, wherein the chamber includes a first region and a second region separated by the drain cup, the first region being formed between the drain cup and an inner wall of the chamber, and the second region includes an inside of the drain cup, wherein said second region is surrounded by the drain cup,
• wherein the second portion of the drain cup is fixedly attached to a first position of the lower wall of the chamber,
• wherein the first position of the lower wall of the chamber is disposed between the lower inlet and the fluid outlet, and wherein the drain cup is located above the lower wall of the chamber, and a gap is located between the first portion of the drain cup and the lower wall of the chamber,
• wherein the drain cup further includes a connecting groove formed in the first portion of the drain cup,
• wherein at least a part of a first protrusion portion of the chamber is inserted into the connecting groove of the drain cup,
• wherein the chamber and the lower inlet are configured such that the first supercritical fluid is provided to the first region, and
• wherein the chamber and the upper inlet are configured such that the second supercritical fluid is provided to the second region.