C23C 18/1628
Specific elements or parts of the apparatus
Official title: {Specific elements or parts of the apparatus}
C23C18/1628 (Specific elements or parts of the apparatus) appears on 168 US grants and 211 published applications in this corpus.
Search patents in C23C- Granted patents
- 168
- Published applications
- 211
- Assignees
- 99
- Inventors
- 404
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 1 | 1 |
| 2003 | 2 | 4 |
| 2004 | 1 | 4 |
| 2005 | 3 | 10 |
| 2006 | 3 | 8 |
| 2007 | 2 | 9 |
| 2008 | 4 | 6 |
| 2009 | 4 | 5 |
| 2010 | 5 | 6 |
| 2011 | 9 | 7 |
| 2012 | 8 | 5 |
| 2013 | 2 | 4 |
| 2014 | 8 | 8 |
| 2015 | 3 | 11 |
| 2016 | 10 | 19 |
| 2017 | 13 | 15 |
| 2018 | 11 | 7 |
| 2019 | 7 | 14 |
| 2020 | 8 | 13 |
| 2021 | 11 | 13 |
| 2022 | 10 | 17 |
| 2023 | 8 | 8 |
| 2024 | 5 | 12 |
| 2025 | 12 | 3 |
| 2026 | 4 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Substrate liquid processing apparatus and substrate liquid processing method29 Sep 2026US 12,747,504 B2Tokyo Electron Limited
- Method of fabricating semiconductor device using apparatus for supplying supercritical fluids2 Jun 2026US 12,644,188 B2Samsung Electronics Co., Ltd.
- Electroless plating apparatus3 Mar 2026US 12,565,705 B2ASKA CORPORATION Co., Ltd.
- Catalyst ink for plating and electroless plating method using same10 Feb 2026US 12,545,799 B2Korea Electrotechnology Research Institute
- Pre-wet process method25 Nov 2025US 12,480,221 B2Ebara Corporation
- Wet processing device with gas-liquid mixing11 Jun 2026US 2026/0159955 A1Yield Engineering Systems, Inc.
- Electroless Deposition Process for Semiconductor Devices19 Jun 2025US 2025/0201565 A1Wolfspeed, Inc.
- System and method for performing localized electroless nickel plating13 Feb 2025US 2025/0051926 A1Nuovo Pignone Tecnologie Srl
- Dual channel flow plate for wet processing30 Jan 2025US 2025/0038013 A1Yield Engineering Systems, Inc.
- Apparatus for fabricating semiconductor device having upper and lower inlets for supplying supercritical fluids and method of fabricating semiconductor device using the same26 Dec 2024US 2024/0425988 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Plating cell with horizontal product load mechanism314US 5,932,077 AReynolds Tech Fabricators, Inc. · 1999
- Measurement techniques for controlling aspects of a electroless deposition process232US 7,465,358 B2APPLIED Materials.Inc. · 2008
- Apparatus for electroless deposition227US 7,341,633 B2APPLIED Materials.Inc. · 2008
- Clamshell apparatus for electrochemically treating wafers141US 6,800,187 B1Novellus Systems, Inc. · 2004
- Process and apparatus for plating onto articles58US 4,576,685 ASchering Corporation · 1986