C23C 18/163
Supporting devices for articles to be coated
Official title: {Supporting devices for articles to be coated}
C23C18/163 (Supporting devices for articles to be coated) appears on 89 US grants and 110 published applications in this corpus.
Search patents in C23C- Granted patents
- 89
- Published applications
- 110
- Assignees
- 52
- Inventors
- 206
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 1 |
| 2003 | 1 | 1 |
| 2004 | 1 | 2 |
| 2005 | 2 | 2 |
| 2006 | 0 | 1 |
| 2007 | 0 | 2 |
| 2008 | 1 | 2 |
| 2009 | 0 | 2 |
| 2010 | 3 | 1 |
| 2011 | 2 | 3 |
| 2012 | 3 | 4 |
| 2013 | 1 | 2 |
| 2014 | 4 | 4 |
| 2015 | 2 | 6 |
| 2016 | 4 | 16 |
| 2017 | 8 | 12 |
| 2018 | 8 | 6 |
| 2019 | 6 | 6 |
| 2020 | 5 | 9 |
| 2021 | 5 | 7 |
| 2022 | 5 | 10 |
| 2023 | 5 | 5 |
| 2024 | 4 | 5 |
| 2025 | 6 | 1 |
| 2026 | 2 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Substrate liquid processing apparatus and substrate liquid processing method29 Sep 2026US 12,747,504 B2Tokyo Electron Limited
- Method of fabricating semiconductor device using apparatus for supplying supercritical fluids2 Jun 2026US 12,644,188 B2Samsung Electronics Co., Ltd.
- Electroless plating process16 Sep 2025US 12,416,093 B2Intel Corporation
- Substrate processing apparatus and substrate processing method2 Sep 2025US 12,404,587 B2Tokyo Electron Limited
- Substrate processing method5 Aug 2025US 12,378,670 B2Tokyo Electron Limited
- Dual channel flow plate for wet processing30 Jan 2025US 2025/0038013 A1Yield Engineering Systems, Inc.
- Apparatus for fabricating semiconductor device having upper and lower inlets for supplying supercritical fluids and method of fabricating semiconductor device using the same26 Dec 2024US 2024/0425988 A1Samsung Electronics Co., Ltd.
- Plating method and plating apparatus19 Sep 2024US 2024/0309511 A1Tokyo Electron Limited
- Substrate processing method, substrate processing apparatus, and recording medium20 Jun 2024US 2024/0200195 A1Tokyo Electron Limited
- Substrate processing method2 May 2024US 2024/0141501 A1Tokyo Electron Limited
Most cited
By later US patents
- Plating cell with horizontal product load mechanism314US 5,932,077 AReynolds Tech Fabricators, Inc. · 1999
- Clamshell apparatus for electrochemically treating wafers141US 6,800,187 B1Novellus Systems, Inc. · 2004
- Process and apparatus for plating onto articles58US 4,576,685 ASchering Corporation · 1986
- Holder for electroless plating and method of electroless plating53US 6,471,777 B1Murata Manufacturing Co., Ltd. · 2002
- Apparatus and method for electroless deposition of materials on semiconductor substrates35US 6,913,651 B2Blue29, LLC · 2005