Substrate processing apparatus and substrate processing method

A substrate processing apparatus, comprising:

• a holder configured to attract and hold a substrate;
• a supply configured to supply a heated plating liquid to the substrate attracted to and held by the holder;
• and
• a cover body configured to cover the substrate attracted to and held by the holder, and configured to heat the plating liquid on the substrate by using a heating device provided in a ceiling member thereof facing a top surface of the substrate,
• wherein the holder is provided with multiple protrusions projecting from a facing surface thereof facing a bottom surface of the substrate toward the bottom surface of the substrate, and each protrusion has a protruding height equal to or larger than 1 mm,
• the heating device comprises multiple individual heating elements that are arranged concentrically and configured to be temperature-controlled individually,
• the holder has a diameter smaller than that of the substrate, and is disposed to be concentric with the multiple individual heating elements, and
• when a first heating element located directly above the holder among the multiple individual heating elements is assumed to have a diameter A and a distance between the first heating element and a second heating element adjacent to the first heating element among the multiple individual heating elements is assumed to be a distance B, the diameter of the holder may be equal to or larger than A−(B/2) and equal to or less than A+(B/2).