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US 12,416,093 B2Granted
Electroless plating process
AssigneeIntel Corporation
InventorsChandrasekharan Nair, Darko Grujicic, Rengarajan Shanmugam, Srinivasan Raman, Roy Dittler, Daniel Sowa, Robert Baresel, II, Marcel Wall, Rahul Manepalli
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Abstract
The present disclosure is directed to an electroless plating process using a panel basket for holding semiconductor panels comprising a plurality of metal pads and shielding the metal pads from contaminants and over-etching and under-etching caused by the contaminants.
Claims13
An electroless plating process comprising:
- providing a panel basket;
- providing semiconductor panels comprising a plurality of metal pads;
- providing a pretreatment etching for the semiconductor panels comprising:
- placing the semiconductor panels into the panel basket made from a basket material;
- shielding the metal pads on the semiconductor panel from contaminants during the pretreatment etching to prevent over-etching and under-etching of the metal pads on the semiconductor panels;
- and
- performing electroless plating process steps with the semiconductor panels;
- wherein the panel basket is configured with two panel end plates made of the basket material and a plurality of opposing slots for carrying the semiconductor panels in and out of baths during the electroless plating process;
- wherein the semiconductor panels are positioned proximal to each of the panel end plates;
- and
- wherein the shielding the metal pads comprises providing a distance between the contaminants and the metal pads by positioning an insulating insert between the semiconductor panels and the panel end plates.
8 more elements
Dependencies are inferred from the claim text.