Substrate processing method
AssigneeTokyo Electron Limited
InventorsTetsuro Shirasaka, Naoto Nakamura
Life of this patent
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Abstract
A controller performs an adjustment processing including: forming a film on a surface of a substrate by a film forming unit; removing a peripheral portion of the film by the film forming unit; acquiring surface information indicating a state of the surface of the substrate including the film, from which the peripheral portion has been removed, by a surface inspection unit and adjusting a cut width of the peripheral portion based on the surface information; and peeling the film, from which the peripheral portion has been removed, by the film forming unit, and a process processing including: forming the film on the surface of the substrate by the film forming unit; and removing the peripheral portion by the cut width adjusted in the adjustment processing in the film forming unit.
Claims9
A substrate processing method, comprising:
- performing an adjustment processing including:
- forming a film on a surface of a substrate by a film forming unit configured to form the film on the surface of the substrate and remove at least a part of the film;
- removing a peripheral portion of the film by the film forming unit;
- adjusting a cut width of the peripheral portion based on surface information indicating a state of the surface of the substrate including the film, from which the peripheral portion has been removed;
- and peeling the film, from which the peripheral portion has been removed, by the film forming unit;
- and
- performing a process processing including:
- forming the film on the surface of the substrate by the film forming unit;
- and removing the peripheral portion by the cut width adjusted in the adjustment processing in the film forming unit.
Dependencies are inferred from the claim text.