Substrate processing method

A substrate processing method, comprising:

• performing an adjustment processing including:
• forming a film on a surface of a substrate by a film forming unit configured to form the film on the surface of the substrate and remove at least a part of the film;
• removing a peripheral portion of the film by the film forming unit;
• adjusting a cut width of the peripheral portion based on surface information indicating a state of the surface of the substrate including the film, from which the peripheral portion has been removed;
• and peeling the film, from which the peripheral portion has been removed, by the film forming unit;
• and
• performing a process processing including:
• forming the film on the surface of the substrate by the film forming unit;
• and removing the peripheral portion by the cut width adjusted in the adjustment processing in the film forming unit.