Apparatus for electroless deposition

An electroless fluid processing assembly, comprising

• a processing enclosure positioned on a substrate processing system, the substrate processing enclosure having an access port configured to allow access to an interior portion of the processing enclosure by an external robot;
• an electroless activation cell positioned in the interior portion of the processing enclosure;
• an electroless deposition cell positioned in the interior portion of the processing enclosure;
• a processing gas supply in selective fluid communication with the interior portion of the processing enclosure;
• a processing gas exhaust system in selective fluid communication with the interior portion of the processing enclosure;
• a substrate transfer shuffle positioned in the interior portion of the processing enclosure between the electroless activation cell and the electroless deposition cell;
• and
• at least one of an annealing station and a cleaning cell disposed in an exterior portion of the processing enclosure in the substrate processing system.

A fluid processing platform, comprising:

• a mainframe having a substrate transfer robot positioned thereon;
• at least one substrate cleaning cell positioned on the mainframe;
• and
• at least one processing enclosure positioned on the mainframe, the processing enclosure comprising:
• a gas supply positioned in fluid communication with an interior of the processing enclosure;
• a first fluid processing cell positioned in the interior of the processing enclosure;
• a first head assembly positioned to support a substrate for processing in the first fluid processing cell;
• a second fluid processing cell positioned in the interior of the processing enclosure;
• a second head assembly positioned to support a substrate for processing in the second fluid processing cell;
• and
• a substrate shuffle positioned between the first and second fluid processing cells and being configured to transfer substrates between the fluid processing cells and the substrate transfer robot of the mainframe,
• wherein an access port is formed through a wall of the processing enclosure and is configured to provide access between the substrate transfer robot of the mainframe and the interior of the processing enclosure.

A fluid deposition system for semiconductor processing, comprising:

• a mainframe having a substrate transfer robot positioned thereon;
• and
• at least two substrate processing enclosures positioned on the mainframe and accessible to the substrate transfer robot via an access port formed through a wall of the corresponding substrate processing enclosure, each of the substrate processing enclosures having at least one substrate fluid processing cell positioned therein;
• wherein the at least one substrate fluid processing cell comprises an electroless fluid activation cell and an electroless fluid deposition cell positioned adjacent each other in the substrate processing enclosure, the electroless fluid activation cell and the electroless fluid deposition cell each comprise a substrate support member configured to support a substrate during fluid processing in the respective cells, the substrate support member having a temperature control assembly therein, the temperature control assembly comprises a plurality of individually controlled heating elements positioned in the substrate support member, the electroless fluid activation cell and an electroless fluid deposition cell each comprises a processing fluid basin having a fluid retention weir surrounding the processing fluid basin and at least one processing fluid supply aperture positioned on the processing fluid basin, the processing fluid supply aperture being in fluid communication with a processing fluid source.