Pre-wet process method

A pre-wet process method for performing a pre-wet process before performing a plating process on a substrate in a plating apparatus,

• the plating apparatus comprising a plating module for performing the plating process on the substrate, and a pre-wet module for performing the pre-wet process on the substrate,
• the pre-wet module including a nozzle head configured to be able to supply a pre-wet liquid to a plate surface of the substrate with movement along the plate surface of the substrate, and
• a computer configured to perform the pre-wet process method comprising:
• retrieving a recipe related to a plurality of processes associated with plating the substrate;
• calculating by the computer, based at least in part on the recipe, a maximum process time in the pre-wet module based on a rate limiting step of limiting a rate of a first process among the plurality of processes associated with plating the substrate;
• calculating by the computer a minimum moving speed of the nozzle head based on the calculated maximum process time;
• instructing the plating apparatus by the computer to transfer the substrate to the pre-wet module;
• instructing the nozzle head by the computer to move at a predetermined slowest recommended speed equal to or more than the calculated minimum moving speed to supply the pre-wet liquid to the plate surface of the substrate;
• and
• instructing the plating apparatus by the computer to transfer the substrate to the plating module for plating at the completion of supplying the pre-wet liquid.