Electroless deposition equipment or apparatus and method of performing electroless deposition
AssigneesCornell Research Foundation, Inc., Sematech, Inc., Intel Corporation
InventorsYosi Shacham-Diamand, Valery M. Dubin, Chiu H. Ting, Bin Zhao, Prahalad K. Vasudev
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Abstract
An electroless deposition apparatus and a method of electroless deposition that uses a single process chamber for performing multiple processes by moving through the process chamber a variety of fluids one at a time in a sequential order.
Claims15
A method for processing a semiconductor wafer using electroless deposition that subjects the wafer to more than one processing fluid in a sealed process chamber while retaining the wafer in said sealed process chamber and allowing the processing of wafers to proceed in the absence of air, comprising the following steps:
- introducing the first processing fluid from a distribution system into a sealed process chamber to process the wafer;
- removing the first processing fluid from said sealed process chamber to said distribution system after processing the wafer;
- introducing the next processing fluid from said distribution system into said sealed process chamber to process the wafer;
- and
- removing the next processing fluid from said sealed process chamber to said distribution system after processing the wafer while retaining the wafer in said sealed process chamber.
A method for processing a semiconductor wafer using electroless deposition that uses a sealed process chamber to subject the wafer to more than one processing fluid while retaining the wafer in said sealed process chamber and allowing the processing of wafers to proceed in the absence of air, comprising the following steps:
- adding the first processing fluid into a sealed process chamber through an inlet;
- containing the first processing fluid in said sealed process chamber while the first fluid processes the semiconductor wafer;
- removing the first processing fluid from said sealed process chamber through an outlet after processing the semiconductor wafer;
- adding the next processing fluid into said sealed process chamber through said inlet;
- containing the next processing fluid in said sealed process chamber while the next processing fluid processes the semiconductor wafer;
- and
- removing the next processing fluid from said sealed process chamber through said outlet after processing the semiconductor wafer.
Dependencies are inferred from the claim text.