C23C 18/1617
Purification and regeneration of coating baths
Official title: {Purification and regeneration of coating baths}
C23C18/1617 (Purification and regeneration of coating baths) appears on 155 US grants and 101 published applications in this corpus.
Search patents in C23C- Granted patents
- 155
- Published applications
- 101
- Assignees
- 94
- Inventors
- 431
- Latest grant
- 18 Nov 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 3 | 0 |
| 1979 | 3 | 0 |
| 1980 | 0 | 0 |
| 1981 | 5 | 0 |
| 1982 | 3 | 0 |
| 1983 | 3 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 4 | 0 |
| 1987 | 7 | 0 |
| 1988 | 7 | 0 |
| 1989 | 3 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 5 | 0 |
| 1993 | 8 | 0 |
| 1994 | 5 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 1 | 0 |
| 1999 | 6 | 0 |
| 2000 | 3 | 0 |
| 2001 | 5 | 0 |
| 2002 | 4 | 6 |
| 2003 | 3 | 3 |
| 2004 | 6 | 13 |
| 2005 | 5 | 7 |
| 2006 | 0 | 3 |
| 2007 | 3 | 5 |
| 2008 | 1 | 4 |
| 2009 | 2 | 5 |
| 2010 | 7 | 2 |
| 2011 | 5 | 6 |
| 2012 | 4 | 3 |
| 2013 | 3 | 5 |
| 2014 | 3 | 5 |
| 2015 | 2 | 6 |
| 2016 | 5 | 6 |
| 2017 | 4 | 5 |
| 2018 | 1 | 3 |
| 2019 | 3 | 1 |
| 2020 | 3 | 0 |
| 2021 | 1 | 2 |
| 2022 | 2 | 2 |
| 2023 | 0 | 2 |
| 2024 | 0 | 4 |
| 2025 | 1 | 1 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electroless plating systems and methods18 Nov 2025US 12,473,650 B1The Boeing Company
- Method and apparatus for performing immersion tin process or copper plating process in the production of a component carrier9 Aug 2022US 11,408,076 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Online resourceful treatment method of electroless copper plating waste solution31 May 2022US 11,345,622 B2Chongqing Muncipal Solid Waste Management Center
- Systems for removing impurities from galvanizing flux solution17 Aug 2021US 11,091,828 B2Beta Control Systems, Incorporated
- Elimination of H2S in immersion tin plating solution15 Sep 2020US 10,774,425 B2MacDermid Enthone Inc.
- Wet processing device with gas-liquid mixing11 Jun 2026US 2026/0159955 A1Yield Engineering Systems, Inc.
- Method for forming metal oxide coating30 Apr 2026US 2026/0117388 A1C. Uyemura & Co., Ltd.
- Use of an aqueous alkaline composition for the electroless deposition of a metal or metal alloy on a metal surface of a substrate30 Jan 2025US 2025/0034718 A1Atotech Deutschland GmbH
- Apparatus for measuring plating deposition status22 Aug 2024US 2024/0279814 A1C. Uyemura & Co., Ltd.
- Plating Solutions for Composite PTFE Plating11 Jul 2024US 2024/0228816 A1Surface Technology, Inc.
Most cited
By later US patents
- Plating cell with horizontal product load mechanism314US 5,932,077 AReynolds Tech Fabricators, Inc. · 1999
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997
- Electroless copper deposition method for preparing copper seed layers41US 6,664,122 B1Novellus Systems, Inc. · 2003
- Selective removal of copper or nickel from complexing agents in aqueous solution37US 4,303,704 A1981
- Method of replenishing electroless gold plating baths37US 5,635,253 AInternational Business Machines Corporation · 1997