Method and apparatus for performing immersion tin process or copper plating process in the production of a component carrier
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorHeinrich Trischler
Life of this patent
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Abstract
A method of performing an immersion tin process in the production of a component carrier is provided which includes immersing at least a part of a copper surface of the component carrier in a composition containing Sn(II) in an immersion tin unit, while passing a non-oxidizing gas through the immersion tin unit, wherein at least part of the non-oxidizing gas is recycled. In addition, an apparatus for performing an immersion tin process in the production of a component carrier, a method of performing a copper plating process in the production of a component carrier and an apparatus for performing a copper plating process in the production of a component carrier are provided.
Claims9
A method of performing an immersion tin process in the production of a component carrier, the method comprising:
- immersing at least a part of a copper surface of the component carrier in a composition containing Sn(II) in an immersion tin unit, while passing a non-oxidizing gas through the immersion tin unit, wherein at least part of the non-oxidizing gas is recycled,
- the method further comprising circulating at least part of the non-oxidizing gas through a H2S removing unit.
Dependencies are inferred from the claim text.