C23C 18/1635
Composition of the substrate
Official title: {Composition of the substrate}
C23C18/1635 (Composition of the substrate) appears on 714 US grants and 1,034 published applications in this corpus.
Search patents in C23C- Granted patents
- 714
- Published applications
- 1,034
- Assignees
- 584
- Inventors
- 2,512
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 1 | 0 |
| 1978 | 5 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 5 | 0 |
| 1983 | 2 | 0 |
| 1984 | 4 | 0 |
| 1985 | 2 | 0 |
| 1986 | 4 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 4 | 0 |
| 1990 | 4 | 0 |
| 1991 | 6 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 3 | 0 |
| 1995 | 7 | 0 |
| 1996 | 9 | 0 |
| 1997 | 5 | 0 |
| 1998 | 2 | 0 |
| 1999 | 9 | 0 |
| 2000 | 11 | 0 |
| 2001 | 7 | 1 |
| 2002 | 4 | 8 |
| 2003 | 3 | 10 |
| 2004 | 13 | 19 |
| 2005 | 6 | 16 |
| 2006 | 5 | 14 |
| 2007 | 7 | 27 |
| 2008 | 5 | 24 |
| 2009 | 7 | 18 |
| 2010 | 14 | 36 |
| 2011 | 9 | 31 |
| 2012 | 22 | 41 |
| 2013 | 13 | 28 |
| 2014 | 35 | 44 |
| 2015 | 32 | 77 |
| 2016 | 28 | 93 |
| 2017 | 47 | 86 |
| 2018 | 59 | 59 |
| 2019 | 58 | 79 |
| 2020 | 33 | 63 |
| 2021 | 59 | 62 |
| 2022 | 45 | 55 |
| 2023 | 31 | 47 |
| 2024 | 28 | 44 |
| 2025 | 29 | 34 |
| 2026 | 14 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for forming electroless plating electrode through selective cross-linking layer formation using laser6 Oct 2026US 12,753,514 B2Andong National University Industry-Academic Cooperation Foundation
- Apparatus and method for electroless surface finishing on glass15 Sep 2026US 12,740,460 B2Intel Corporation
- Process for wet-chemical formation of a stable tin oxide layer for printed circuit boards25 Aug 2026US 12,716,133 B2Atotech Deutschland GmbH
- Composition for depositing a palladium coating on a substrate23 Jun 2026US 12,662,738 B2Atotech Deutschland GmbH
- Power component submount and manufacturing method thereof23 Jun 2026US 12,666,542 B2Tong Hsing Electronic Industries, Ltd.
- Method for preparing non-electrically conductive antimicrobial articles17 Sep 2026US 2026/0275167 A1Eastman Kodak Company
- Substrate liquid processing method and substrate liquid processing apparatus27 Aug 2026US 2026/0255892 A1Tokyo Electron Limited
- Chromium acid etching free metal plating of blends of acrylonitrile-butadiene-styrene and polar polymer16 Jul 2026US 2026/0201157 A1Sabic Global Technologies B.V.
- Manufacturing method of rolled surface-treated steel sheet and rolled surface-treated steel sheet2 Jul 2026US 2026/0185235 A1Toyo Kohan Co.Ltd
- Method of manufacturing nebuliser aperture plates25 Jun 2026US 2026/0176766 A1Stamford Devices Limited
Most cited
By later US patents
- Palladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal deposition270US 5,380,560 AInternational Business Machines Corporation · 1995
- Electroless plating liquid and semiconductor device258US 6,717,189 B2Ebara Corporation · 2004
- Conductor track structures and method for production thereof118US 7,060,421 B2Lpkf Laser & Electronics AG · 2006
- Plated terminations97US 6,960,366 B2AVX Corporation · 2005
- Selective electroless plating process for metal conductors94US 5,167,992 AMicroelectronics and Computer Technology Corporation · 1992