C23C 18/1639
Substrates other than metallic
Official title: {Substrates other than metallic, e.g. inorganic or organic or non-conductive}
C23C18/1639 (Substrates other than metallic) appears on 384 US grants and 589 published applications in this corpus.
Search patents in C23C- Granted patents
- 384
- Published applications
- 589
- Assignees
- 344
- Inventors
- 1,416
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 3 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 4 | 0 |
| 1991 | 5 | 0 |
| 1992 | 0 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 5 | 0 |
| 1996 | 6 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 5 | 0 |
| 2000 | 8 | 0 |
| 2001 | 5 | 1 |
| 2002 | 3 | 3 |
| 2003 | 1 | 2 |
| 2004 | 5 | 4 |
| 2005 | 4 | 6 |
| 2006 | 3 | 8 |
| 2007 | 2 | 12 |
| 2008 | 4 | 13 |
| 2009 | 2 | 10 |
| 2010 | 7 | 23 |
| 2011 | 5 | 15 |
| 2012 | 8 | 22 |
| 2013 | 4 | 12 |
| 2014 | 14 | 19 |
| 2015 | 17 | 44 |
| 2016 | 18 | 56 |
| 2017 | 20 | 51 |
| 2018 | 36 | 34 |
| 2019 | 32 | 54 |
| 2020 | 23 | 41 |
| 2021 | 32 | 38 |
| 2022 | 26 | 27 |
| 2023 | 19 | 30 |
| 2024 | 14 | 30 |
| 2025 | 14 | 23 |
| 2026 | 9 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for forming electroless plating electrode through selective cross-linking layer formation using laser6 Oct 2026US 12,753,514 B2Andong National University Industry-Academic Cooperation Foundation
- Apparatus and method for electroless surface finishing on glass15 Sep 2026US 12,740,460 B2Intel Corporation
- Power component submount and manufacturing method thereof23 Jun 2026US 12,666,542 B2Tong Hsing Electronic Industries, Ltd.
- Metallized polymer particles and related methods2 Jun 2026US 12,644,187 B2Xerox Corporation
- Electroless plating apparatus3 Mar 2026US 12,565,705 B2ASKA CORPORATION Co., Ltd.
- Method for preparing non-electrically conductive antimicrobial articles17 Sep 2026US 2026/0275167 A1Eastman Kodak Company
- Substrate liquid processing method and substrate liquid processing apparatus27 Aug 2026US 2026/0255892 A1Tokyo Electron Limited
- Chromium acid etching free metal plating of blends of acrylonitrile-butadiene-styrene and polar polymer16 Jul 2026US 2026/0201157 A1Sabic Global Technologies B.V.
- Method of manufacturing nebuliser aperture plates25 Jun 2026US 2026/0176766 A1Stamford Devices Limited
- Liquid-phase deposition of thin films11 Jun 2026US 2026/0159954 A1Coreshell Technologies, Incorporated
Most cited
By later US patents
- Conductor track structures and method for production thereof118US 7,060,421 B2Lpkf Laser & Electronics AG · 2006
- Plated terminations97US 6,960,366 B2AVX Corporation · 2005
- Method for manufacturing an antenna body for a phone72US 6,333,716 B1Nokia Mobile Limited · 2001
- Conductive powder and making process62US 6,485,831 B1Shin-Etsu Chemical Co., Ltd. · 2002
- Printable electric circuits, electronic components and method of forming the same57US 7,902,639 B2Siluria Technologies, Inc. · 2011