C23C 18/1642
Semiconductor
Official title: {semiconductor (semiconductor H10P14/48)}
C23C18/1642 (Semiconductor) appears on 39 US grants and 71 published applications in this corpus.
Search patents in C23C- Granted patents
- 39
- Published applications
- 71
- Assignees
- 50
- Inventors
- 195
- Latest grant
- 3 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 1 | 4 |
| 2009 | 1 | 2 |
| 2010 | 2 | 2 |
| 2011 | 1 | 5 |
| 2012 | 2 | 2 |
| 2013 | 0 | 4 |
| 2014 | 2 | 2 |
| 2015 | 2 | 3 |
| 2016 | 1 | 4 |
| 2017 | 1 | 3 |
| 2018 | 2 | 4 |
| 2019 | 2 | 6 |
| 2020 | 2 | 3 |
| 2021 | 6 | 10 |
| 2022 | 4 | 3 |
| 2023 | 2 | 2 |
| 2024 | 0 | 3 |
| 2025 | 3 | 5 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electroless plating apparatus3 Mar 2026US 12,565,705 B2ASKA CORPORATION Co., Ltd.
- Electroless plating process16 Sep 2025US 12,416,093 B2Intel Corporation
- Substrate processing apparatus and substrate processing method2 Sep 2025US 12,404,587 B2Tokyo Electron Limited
- Metal-containing fabrics and membranes, and method of manufacturing thereof17 Jun 2025US 12,336,097 B2Imperial College Innovations Limited
- Methods and apparatus for electroless plating dispense26 Sep 2023US 11,769,686 B2Intel Corporation
- Substrate liquid processing method and substrate liquid processing apparatus27 Aug 2026US 2026/0255892 A1Tokyo Electron Limited
- Electrically conductive metal-coated fibers, continuous process for preparation thereof, and use thereof29 Jan 2026US 2026/0028532 A1Syscom Advanced Materials, Inc.
- System and method for electrochemical additive manufacturing4 Sep 2025US 2025/0277311 A1The Research Foundation for The State University of New York
- Electroless Deposition Process for Semiconductor Devices19 Jun 2025US 2025/0201565 A1Wolfspeed, Inc.
- Electroless Deposition Process for Semiconductor Devices19 Jun 2025US 2025/0201740 A1Wolfspeed, Inc.
Most cited
By later US patents
- Method for forming a thin film layer13US 5,462,897 AInternational Business Machines Corporation · 1995
- Substrate processing unit and substrate processing apparatus10US 7,368,016 B2Ebara Corporation · 2008
- Photo-plating solution and process9US 5,424,252 AKabushiki Kaisha Toyota Chuo Kenkyusho · 1995
- Photoselective electroless plating method employing UV-absorbing substrates8US 4,738,869 APacific Bell · 1988
- Adhesion promoting process for metallisation of substrate surfaces5US 10,487,404 B2Atotech Deutschland GmbH · 2019