Adhesion promoting process for metallisation of substrate surfaces
AssigneeAtotech Deutschland GmbH
InventorsZhiming Liu, Hailuo Fu, Sara Hunegnaw, Lutz Brandt
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Abstract
A method is provided for metallisation of non-conductive substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies a metal oxide adhesion promoter which is activated and then metal plated. The method provides high adhesion of the non-conductive substrate to the plated metal layer.
Claims18
Wet chemical method for plating a metal onto glass comprising the steps of:
- i. depositing on at least a portion of a surface of the glass a layer of a metal oxide compound selected from the group consisting of zinc oxides, titanium oxides, zirconium oxides, aluminum oxides, silicon oxides, tin oxides, and mixtures of the aforementioned, wherein
- the glass surface has an average surface roughness in a range from 0.1 to 100 nm, and
- depositing the layer of metal oxide compound comprises
- ia. contacting the glass with a solution comprising a metal oxide precursor compound suitable to form the metal oxide compound upon heating and thereafter
- ib. heating the glass at a temperature in a range from 100° C. to 300° C. and thereby forming the metal oxide compound from the metal oxide precursor compound;
- and thereafter
- ii. heating the glass at a temperature in a range from more than 400° C. to 600° C. and thereby forming an adhesive layer with a thickness of 5 nm to 10 nm of the metal oxide compound on at least a portion of the glass surface;
- and thereafter
- iii. metal plating at least the glass surface bearing the adhesive layer of the metal oxide compound by applying a wet-chemical plating method and thereafter;
- iv. heating for 5 to 120 minutes the metal plated layer to a maximum temperature of between 150 and 500° C.
Wet chemical method for plating a metal on glass comprising the steps of:
- i. depositing on at least a portion of a surface of the glass a layer of a metal oxide compound selected from the group consisting of zinc oxides, zirconium oxides, and mixtures of the aforementioned, wherein
- the glass surface has an average surface roughness in a range from 0.1 to 50 nm, and
- depositing the layer of metal oxide compound comprises
- ia. contacting the glass with a solution comprising a metal oxide precursor compound selected from the group consisting of metal methoxylate, ethoxylate, propoxylate, butoxylate, acetate, acetyl-acetonates, nitrate, chloride, bromide and iodide, each suitable to form the metal oxide compound upon heating and thereafter
- ib. heating the glass at a temperature in a range from 100° C. to 300° C. and thereby forming the metal oxide compound from the metal oxide precursor compound;
- and thereafter
- ii. heating the glass at a temperature in a range from 500° C. to 600° C. and thereby forming an adhesive layer with a thickness of 5 nm to 10 nm of the metal oxide compound on at least a portion of the glass surface;
- and thereafter
- iii. metal plating at least the glass surface bearing the adhesive layer of the metal oxide compound by applying a wet-chemical plating method depositing copper, nickel, or alloys thereof, and thereafter;
- iv. heating for 5 to 120 minutes the metal plated layer to a maximum temperature of between 150 and 500° C.
Wet chemical method for plating copper or copper alloy onto glass comprising the steps of:
- i. depositing on at least a portion of a surface of the glass a layer of zinc oxides, wherein
- the glass surface has an average surface roughness in a range from 0.1 to less than 50 nm, and
- depositing the layer of zinc oxides comprises
- ia. dipping the glass into a solution comprising a zinc oxide precursor compound selected from the group consisting of zinc methoxylate, ethoxylate, propoxylate, butoxylate, acetate, and acetyl-acetonates, each suitable to form the zinc oxides upon heating and thereafter
- ib. heating the glass at a temperature in a range from 100° C. to 300° C. and thereby forming the zinc oxides from the zinc oxide precursor compound;
- and thereafter
- ii. heating the glass at a temperature in a range from 500° C. to 600° C. and thereby forming an adhesive layer with a thickness of 5 nm to 10 nm of the zinc oxides on at least a portion of the glass surface;
- and thereafter
- iii. metal plating at least the glass surface bearing the adhesive layer of the zinc oxides by applying a wet-chemical plating method depositing copper or a copper alloy, and thereafter;
- iv. heating for 10 to 120 minutes the copper or copper alloy to a maximum temperature of between 150 and 500° C.
Dependencies are inferred from the claim text.