Conductive powder and making process
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsMotoo Fukushima, Kunio Itoh, Shigeru Mori, Masaki Kasahima, Yoshitaka Hamada, Mikio Aramata
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Abstract
A conductive powder having an organic silicon polymer layer on the surface of each particle and a metal layer enclosing the silicon polymer layer possesses a stronger bond between the particle base and the metal even at elevated temperature and exhibits a high and stable conductivity and heat resistance.
Claims17
A conductive powder comprising particles each having a surface, an organic silicon polymer layer formed on the particle surface, and a metal layer enclosing the organic silicon polymer layer.
A conductive powder comprising particles each having a surface, a partially or entirely ceramic layer formed from an organic silicon polymer on the particle surface, and a metal layer enclosing the ceramic layer.
A conductive powder comprising particles each having a surface, and an organic silicon polymer layer, a nickel-phosphorus alloy layer, and a gold layer formed successively on the particle surface, wherein said nickel-phosphorus alloy layer has a phosphorus content which differs between inner and outer surface regions.
A conductive powder comprising particles each having a surface, and a partially or entirely ceramic layer of an organic silicon polymer, a nickel-phosphorus alloy layer, and a gold layer formed successively on the particle surface, wherein said nickel-phosphorus alloy layer has a phosphorus content which differs between inner and outer surface regions.
Dependencies are inferred from the claim text.