C23C 18/1637
Metallic substrate
Official title: {metallic substrate}
C23C18/1637 (Metallic substrate) appears on 177 US grants and 265 published applications in this corpus.
Search patents in C23C- Granted patents
- 177
- Published applications
- 265
- Assignees
- 173
- Inventors
- 629
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 2 |
| 2004 | 2 | 4 |
| 2005 | 0 | 2 |
| 2006 | 0 | 2 |
| 2007 | 3 | 5 |
| 2008 | 1 | 1 |
| 2009 | 0 | 3 |
| 2010 | 3 | 4 |
| 2011 | 2 | 4 |
| 2012 | 3 | 12 |
| 2013 | 3 | 6 |
| 2014 | 12 | 10 |
| 2015 | 6 | 23 |
| 2016 | 4 | 20 |
| 2017 | 19 | 30 |
| 2018 | 16 | 15 |
| 2019 | 17 | 14 |
| 2020 | 7 | 16 |
| 2021 | 22 | 18 |
| 2022 | 11 | 25 |
| 2023 | 8 | 12 |
| 2024 | 8 | 16 |
| 2025 | 12 | 13 |
| 2026 | 7 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Process for wet-chemical formation of a stable tin oxide layer for printed circuit boards25 Aug 2026US 12,716,133 B2Atotech Deutschland GmbH
- Composition for depositing a palladium coating on a substrate23 Jun 2026US 12,662,738 B2Atotech Deutschland GmbH
- Metallic coated substrates10 Mar 2026US 12,571,105 B2Armadillo Metal Coatings Ltd
- Anti-diffusion substrate structure and manufacturing method thereof3 Mar 2026US 12,568,810 B2Unimicron Technology Corp.
- Bendable nickel plating on flexible substrates17 Feb 2026US 12,553,134 B2MacDermid Enthone Inc.
- Manufacturing method of rolled surface-treated steel sheet and rolled surface-treated steel sheet2 Jul 2026US 2026/0185235 A1Toyo Kohan Co.Ltd
- Liquid-phase deposition of thin films11 Jun 2026US 2026/0159954 A1Coreshell Technologies, Incorporated
- Triple core-shell catalyst complex for electrochemical device and method of manufacturing same28 May 2026US 2026/0149006 A1Hyundai Motor Company
- Nickel plated steel sheet for battery case having excellent surface corrosion resistance and method for manufacturing28 May 2026US 2026/0149092 A1TCC Steel Corp.
- Assembly with an electric feedthrough and method for the production thereof28 May 2026US 2026/0150190 A1Schott AG
Most cited
By later US patents
- Palladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal deposition270US 5,380,560 AInternational Business Machines Corporation · 1995
- Annealing process for electroless coated disks for high temperature applications72US 8,668,953 B1WD Media, LLC · 2014
- Non-flammable and strippable plating resist and method of using same58US 5,035,918 AAMP Incorporated · 1991
- Selective plating by laser ablation50US 4,877,644 AAMP Incorporated · 1989
- Electroless plating solution and process36US 6,797,312 B2Mattson Technology, Inc. · 2004