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AssigneeAMP Incorporated
InventorsJeff C. Wu, Richard T. Williams, John R. Rowlette, Charles P. Brooks, Richard H. Zimmerman
Estimating the term…
A method for the selective plating of a metal substrate on which a thin polymeric plating resist is first applied, followed by the selective removal of said resist to expose portions of said substrate to plating, and plating. More particularly, the method hereof includes the steps of selecting a laser wavelength which couples well to the metal substrate, choosing a polymer based plating resist having a low optical coefficient of absorption at said wavelength, curing said resist, subjecting selective areas of said resist to a single excimer laser shot, having a short wavelength, to cause ablative removal of the resist over the selective areas of said substrate, and subjecting said exposed portions of said substrate to metal plating.
In a method for the selective plating of a metal substrate where a think polymeric plating resist is first applied to said substrate, followed by selective laser ablation of said resist to expose portions of said substrate to plating, the improvement comprising in combination therewith the steps of
The method according to claim 10 characterized in that said resist is a styrene acrylic copolymer.
In a method for preparing a metal substrate for plating on selective areas thereof, where a thin polymeric plating resist is first applied to said substrate followed by selective laser ablation of said resist to expose said areas of said substrate for plating, the improvement comprising in combination therewith the steps of
Dependencies are inferred from the claim text.