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US 6,797,312 B2Granted
Electroless plating solution and process
AssigneeMattson Technology, Inc.
InventorsBob Kong, Nanhai Li
Life of this patent
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Abstract
Electroless plating solutions are disclosed for forming metal alloys, such as cobalt-tungsten alloys. In accordance with the present invention, the electroless plating solutions may be formulated so as not to contain any alkali metals. Further, the solutions can be formulated without the use of tetramethylammonium hydroxide. In a further embodiment, a plating solution can be formulated that does not require the use of a catalyst, such as a palladium catalyst prior to depositing the metal alloy on a substrate.
Claims18
An electroless plating process for forming a layer in a micro-electronic device comprising:
- providing an electroless plating solution comprising a first reducing agent, a second reducing agent, a pH adjusting agent, a first metal source, and a second metal source, the first reducing agent comprising a hypophosphorous acid or an ammonium hypophosphite, the second reducing agent comprising a borane-dimethylamine complex, the first reducing agent being present in the solution in an amount from about 0.1 to about 0.4 mol/l and the second reducing agent being present in the solution in an amount from about 0.01 to about 0.1 mol/l, the electroless plating solution being alkali metal-free and containing no tetramethylammonium hydroxide;
- and
- contacting a substrate with the electroless plating solution to form a deposit on the substrate by electroless deposition, the deposit comprising a first metal-second metal alloy and wherein the deposit is formed on the substrate without first contacting the substrate with a catalyst.
Dependencies are inferred from the claim text.