C23C 18/1655
Process features
Official title: {Process features}
C23C18/1655 (Process features) appears on 528 US grants and 732 published applications in this corpus.
Search patents in C23C- Granted patents
- 528
- Published applications
- 732
- Assignees
- 462
- Inventors
- 1,806
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 3 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 3 | 0 |
| 1982 | 8 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 4 | 0 |
| 1987 | 2 | 0 |
| 1988 | 4 | 0 |
| 1989 | 5 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 0 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 5 | 0 |
| 1996 | 4 | 0 |
| 1997 | 5 | 0 |
| 1998 | 8 | 0 |
| 1999 | 8 | 0 |
| 2000 | 12 | 0 |
| 2001 | 12 | 4 |
| 2002 | 10 | 14 |
| 2003 | 17 | 14 |
| 2004 | 15 | 37 |
| 2005 | 7 | 28 |
| 2006 | 8 | 31 |
| 2007 | 8 | 29 |
| 2008 | 8 | 29 |
| 2009 | 9 | 30 |
| 2010 | 14 | 33 |
| 2011 | 18 | 29 |
| 2012 | 22 | 29 |
| 2013 | 12 | 30 |
| 2014 | 17 | 37 |
| 2015 | 23 | 40 |
| 2016 | 16 | 58 |
| 2017 | 33 | 40 |
| 2018 | 28 | 36 |
| 2019 | 27 | 35 |
| 2020 | 28 | 36 |
| 2021 | 31 | 23 |
| 2022 | 15 | 26 |
| 2023 | 16 | 24 |
| 2024 | 14 | 18 |
| 2025 | 15 | 13 |
| 2026 | 10 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- C23C 18/1664With additional means during the plating process196
- C23C 18/1662Use of incorporated material in the solution or dispersion137
- C23C 18/1658With two steps starting with metal deposition followed by addition of reducing102
- C23C 18/1657Electroless forming, i.e. substrate removed or destroyed at the end of the81
- C23C 18/166With two steps starting with addition of reducing agent followed by metal70
Recent patents
- Method for forming electroless plating electrode through selective cross-linking layer formation using laser6 Oct 2026US 12,753,514 B2Andong National University Industry-Academic Cooperation Foundation
- Substrate liquid processing method, and recording medium6 Oct 2026US 12,757,697 B2Tokyo Electron Limited
- High-temperature resistant nano-copper produced by laser direct writing, preparation method and application thereof21 Jul 2026US 12,686,924 B2Zhejiang University
- 3D printing-assisted multi-scale metal three-dimensional surface structure preparation method and product9 Jun 2026US 12,649,275 B2Dalian University of Technology
- Plating apparatus and substrate cleaning method21 Apr 2026US 12,606,929 B2Ebara Corporation
- Methods for low temperature bonding using nanoparticles30 Jul 2026US 2026/0223715 A1Adeia Semiconductor Technologies LLC
- Plating apparatus and substrate cleaning method23 Jul 2026US 2026/0209984 A1Ebara Corporation
- Mask and method of manufacturing mask16 Jul 2026US 2026/0201534 A1Dai Nippon Printing Co.Ltd.
- Method of manufacturing nebuliser aperture plates25 Jun 2026US 2026/0176766 A1Stamford Devices Limited
- Liquid-phase deposition of thin films11 Jun 2026US 2026/0159954 A1Coreshell Technologies, Incorporated
Most cited
By later US patents
- Seed layer deposition558US 6,824,665 B2Shipley Company, L.L.C. · 2004
- Electroless deposition of metal films with spray processor361US 6,065,424 ACornell Research Foundation, Inc. · 2000
- Plating cell with horizontal product load mechanism314US 5,932,077 AReynolds Tech Fabricators, Inc. · 1999
- Electroless metal deposition of electronic components in an enclosable vessel270US 6,165,912 ACFMT, Inc. · 2000
- Composite interconnection element for microelectronic components, and method of making same229US 6,029,344 AFormFactor, Inc. · 2000