C23C 18/166
With two steps starting with addition of reducing agent followed by metal
Official title: {with two steps starting with addition of reducing agent followed by metal deposition}
C23C18/166 (With two steps starting with addition of reducing agent followed by metal) appears on 70 US grants and 77 published applications in this corpus.
Search patents in C23C- Granted patents
- 70
- Published applications
- 77
- Assignees
- 63
- Inventors
- 227
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 0 |
| 2002 | 1 | 0 |
| 2003 | 2 | 1 |
| 2004 | 2 | 5 |
| 2005 | 2 | 2 |
| 2006 | 1 | 5 |
| 2007 | 1 | 2 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 3 |
| 2011 | 2 | 4 |
| 2012 | 0 | 1 |
| 2013 | 2 | 2 |
| 2014 | 1 | 6 |
| 2015 | 6 | 9 |
| 2016 | 3 | 14 |
| 2017 | 4 | 6 |
| 2018 | 5 | 2 |
| 2019 | 6 | 4 |
| 2020 | 3 | 1 |
| 2021 | 2 | 4 |
| 2022 | 2 | 2 |
| 2023 | 1 | 2 |
| 2024 | 1 | 1 |
| 2025 | 2 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Substrate liquid processing method, and recording medium6 Oct 2026US 12,757,697 B2Tokyo Electron Limited
- Methodology for coating non-conducting articles with broad-spectrum antimicrobial electroless plating layers5 Aug 2025US 12,378,672 B2
- Metal-containing fabrics and membranes, and method of manufacturing thereof17 Jun 2025US 12,336,097 B2Imperial College Innovations Limited
- Coating method20 Feb 2024US 11,905,598 B2FUJIFILM Corporation
- Process for metallization of electrochemically active powders20 Jun 2023US 11,682,758 B2A123 Systems, Inc.
- Substrate liquid processing method, and recording medium27 Jun 2024US 2024/0213090 A1Tokyo Electron Limited
- Method for Manufacturing Conductive Pattern-Provided Structure7 Sep 2023US 2023/0279553 A1Asahi Kasei Kabushiki Kaisha
- Coating method5 Jan 2023US 2023/0002907 A1FUJIFILM Corporation
- Novel methodology for coating non-conducting articles with broad-spectrum antimicrobial electroless plating layers10 Nov 2022US 2022/0356582 A1
- Method of fabricating and coating copper nanowires24 Feb 2022US 2022/0056587 A1Portland State University
Most cited
By later US patents
- Electroless deposition of metal films with spray processor361US 6,065,424 ACornell Research Foundation, Inc. · 2000
- Resin structure in which manufacturing cost is cheap and sufficient adhesive strength can be obtained and method of manufacturing it68US 6,564,448 B1NEC Corporation · 2003
- Process for the production of a printing plate by inkjet67US 5,501,150 AAgfa-Gevaert · 1996
- Chemical plating process56US 4,002,778 AE. I. Du Pont de Nemours and Company · 1977
- Use of immersion tin and tin alloys as a bonding medium for multilayer circuits35US 4,715,894 ATechno Instruments Investments 1983 Ltd. · 1987