Method of fabricating and coating copper nanowires
AssigneePortland State University
InventorsSuhyun Lee, Suming Wang, Sung Yi
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Abstract
An environmentally friendly method of coating copper nanowires to reduce oxidation and/or increase electrical/thermal conductivity of the copper nanowires. In one embodiment, a method for coating copper nanowires includes preparing a first solution including a dipolar aprotic organic compound, adding copper nanowires to the first solution under stirring while maintaining the first solution at a pre-determined temperature, preparing a second solution including an oxidation resistant metal, coating the copper nanowires in the oxidation resistant metal by adding the second solution to the first solution under stirring and while maintaining the first solution at the pre-determined temperature.
Claims20
A method comprising:
- (a) preparing a first solution including a dipolar aprotic organic compound;
- (b) adding copper nanowires to the first solution under stirring while maintaining the first solution at a pre-determined temperature;
- (c) preparing a second solution comprising an aqueous solution of an oxidation resistant metal;
- (d) coating the copper nanowires in the oxidation resistant metal by adding the second solution prepared in step (c) to the first solution prepared in step (a) under stirring and while maintaining the first solution at the pre-determined temperature.
A method comprising:
- (a) preparing a first solution including a food grade dipolar aprotic organic compound;
- (b) adding copper nanowires to the first solution under stirring while maintaining the first solution at a pre-determined temperature;
- (c) preparing an aqueous solution of silver;
- and
- (d) coating the copper nanowires in silver by adding the aqueous solution of silver prepared in step (c) to the first solution prepared in step (a) under stirring while maintaining the first solution at the pre-determined temperature.
A method for electroless coating of copper nanowires comprising:
- (a) stirring an aqueous solution comprising sodium hydroxide, copper compound, ethylenediamine (EDA), and hydrazine (N2H4) at a temperature between 20° C. and 100° C. and maintaining the solution for a pre-determined duration of time to grow copper nanowires;
- (b) preparing a methylsulfonylmethane (DMSO2) solution with ultrasonic stirring at a temperature between 20° C. and 100° C.;
- (c) adding the copper nanowires prepared in step (a) to the DMSO2 solution prepared in step (b) under ultrasonic stirring and while maintaining the solution at the temperature between 20° C. and 100° C.;
- (d) preparing an aqueous solution of silver by dissolving a silver compound in water;
- and
- (e) coating the copper nanowires in silver by adding the aqueous solution of silver prepared in step (d) to the DMSO2 solution including the copper nanowires prepared in step (c), under ultrasonic stirring and while maintaining the DMSO2 solution at the temperature between 20° C. and 100° C.
Dependencies are inferred from the claim text.