C23C 18/1658
With two steps starting with metal deposition followed by addition of reducing
Official title: {with two steps starting with metal deposition followed by addition of reducing agent}
C23C18/1658 (With two steps starting with metal deposition followed by addition of reducing) appears on 102 US grants and 152 published applications in this corpus.
Search patents in C23C- Granted patents
- 102
- Published applications
- 152
- Assignees
- 125
- Inventors
- 377
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 2 | 0 |
| 2001 | 3 | 1 |
| 2002 | 2 | 0 |
| 2003 | 5 | 6 |
| 2004 | 1 | 7 |
| 2005 | 2 | 5 |
| 2006 | 3 | 9 |
| 2007 | 1 | 5 |
| 2008 | 0 | 4 |
| 2009 | 2 | 14 |
| 2010 | 5 | 12 |
| 2011 | 6 | 13 |
| 2012 | 5 | 6 |
| 2013 | 3 | 4 |
| 2014 | 4 | 8 |
| 2015 | 6 | 9 |
| 2016 | 2 | 9 |
| 2017 | 2 | 6 |
| 2018 | 6 | 4 |
| 2019 | 6 | 4 |
| 2020 | 2 | 3 |
| 2021 | 4 | 2 |
| 2022 | 2 | 3 |
| 2023 | 0 | 10 |
| 2024 | 4 | 6 |
| 2025 | 2 | 1 |
| 2026 | 3 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Substrate liquid processing method, and recording medium6 Oct 2026US 12,757,697 B2Tokyo Electron Limited
- Structures for low temperature bonding using nanoparticles24 Feb 2026US 12,564,086 B2Adeia Semiconductor Technologies LLC
- Method for producing layered product13 Jan 2026US 12,521,792 B2Sumitomo Chemical Company, Limited
- Radio wave transmissive metallic member and method for manufacturing the same20 May 2025US 12,305,285 B2Toyota Jidosha Kabushiki Kaisha
- Alnico-based hard magnetic particle and method for manufacturing the same8 Apr 2025US 12,272,470 B2Korea Minting, Security Printing & Idcard Operating Corp.
- Methods for low temperature bonding using nanoparticles30 Jul 2026US 2026/0223715 A1Adeia Semiconductor Technologies LLC
- A method for coating a component of an electrolyser27 Nov 2025US 2025/0361621 A1Oort Energy Ltd.
- Plating method and plating apparatus19 Sep 2024US 2024/0309511 A1Tokyo Electron Limited
- Structures for low temperature bonding using nanoparticles19 Sep 2024US 2024/0312954 A1Adeia Semiconductor Technologies LLC
- Substrate liquid processing method, and recording medium27 Jun 2024US 2024/0213090 A1Tokyo Electron Limited
Most cited
By later US patents
- Electroless deposition of metal films with spray processor361US 6,065,424 ACornell Research Foundation, Inc. · 2000
- Electroless plating processes197US 6,861,097 B1Shipley Company, L.L.C. · 2005
- Resin structure in which manufacturing cost is cheap and sufficient adhesive strength can be obtained and method of manufacturing it68US 6,564,448 B1NEC Corporation · 2003
- Process for the production of a printing plate by inkjet67US 5,501,150 AAgfa-Gevaert · 1996
- Metal inks, methods of making the same, and methods for printing and/or forming metal films49US 8,066,805 B2Kovio, Inc. · 2011