C23C 18/1657
Electroless forming, i.e. substrate removed or destroyed at the end of the
Official title: {Electroless forming, i.e. substrate removed or destroyed at the end of the process}
C23C18/1657 (Electroless forming, i.e. substrate removed or destroyed at the end of the) appears on 81 US grants and 135 published applications in this corpus.
Search patents in C23C- Granted patents
- 81
- Published applications
- 135
- Assignees
- 93
- Inventors
- 319
- Latest grant
- 9 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 1 |
| 2002 | 0 | 0 |
| 2003 | 2 | 2 |
| 2004 | 1 | 2 |
| 2005 | 1 | 9 |
| 2006 | 0 | 3 |
| 2007 | 2 | 5 |
| 2008 | 1 | 6 |
| 2009 | 2 | 5 |
| 2010 | 2 | 3 |
| 2011 | 2 | 3 |
| 2012 | 3 | 6 |
| 2013 | 2 | 5 |
| 2014 | 3 | 6 |
| 2015 | 2 | 5 |
| 2016 | 4 | 15 |
| 2017 | 7 | 5 |
| 2018 | 5 | 6 |
| 2019 | 7 | 13 |
| 2020 | 5 | 12 |
| 2021 | 9 | 4 |
| 2022 | 2 | 7 |
| 2023 | 7 | 3 |
| 2024 | 4 | 5 |
| 2025 | 3 | 2 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- 3D printing-assisted multi-scale metal three-dimensional surface structure preparation method and product9 Jun 2026US 12,649,275 B2Dalian University of Technology
- Metal foil, carrier with metal foil comprising the same and printed circuit board including the same9 Dec 2025US 12,495,494 B2Ymt Co., Ltd.
- Sacrificial nanotransfer lithography for the metalization of plastics30 Sep 2025US 12,429,763 B2Rutgers, The State University of New Jersey
- Catalyst for hydrogen evolution reaction and preparing method of the same19 Aug 2025US 12,392,046 B2Institute for Basic Science
- Electroless plating method for metal gate fill1 Oct 2024US 12,107,150 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Mask and method of manufacturing mask16 Jul 2026US 2026/0201534 A1Dai Nippon Printing Co.Ltd.
- Method of manufacturing nebuliser aperture plates25 Jun 2026US 2026/0176766 A1Stamford Devices Limited
- Carrier-attached ultra-thin copper foil and manufacturing method thereof11 Sep 2025US 2025/0287508 A1Chang Chun Petrochemical Co., Ltd.
- 3d printing-assisted multi-scale metal three-dimensional surface structure preparation method and product20 Mar 2025US 2025/0091288 A1Dalian University of Technology
- Electroless Plating Method for Metal Gate Fill21 Nov 2024US 2024/0387690 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Composite interconnection element for microelectronic components, and method of making same229US 6,029,344 AFormFactor, Inc. · 2000
- Ultra high thermal performance packaging for optoelectronics devices46US 8,324,633 B2PhotonStar LED Limited · 2012
- Electrochemical fabrication methods using transfer plating of masks37US 7,195,989 B2Microfabrica Inc. · 2007
- Polymer comprising silicone and metal trace30US 7,871,707 B2Second Sight Medical Products, Inc. · 2011
- Process for preparing printed circuits20US 4,001,466 AFormica International Limited · 1977