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US 12,495,494 B2Granted
Metal foil, carrier with metal foil comprising the same and printed circuit board including the same
AssigneeYmt Co., Ltd.
InventorsSung Wook Chun, Bo Mook Chung, Dea Geun Kim, Myong Hwan Park, Nak Eun Ko, Ju Yong Sim
Life of this patent
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Abstract
The present invention relates to a metal foil having a rough surface, a carrier-attached metal foil including the metal foil, and a printed circuit board manufactured using the metal foil. The rough surface is naturally formed during formation of the metal foil. The formation of the rough surface allows the metal foil to have a high adhesive strength to an insulating resin substrate and enables the manufacture of a printed circuit board with improved efficiency.
Claims7
A metal foil comprising a plurality of flat-topped projections,
- wherein,
- each of the projections comprises a protrusion having a truncated cone or polygonal truncated pyramidal shape and a plateau formed at the upper end of the protrusion, and
- the ratio of the length (c) of the plateau to the length (a) of the base of the protrusion is 0.1:1 to 0.7:1 (c/a),
- wherein the protrusion has a surface roughness (Ra) of 0.05 to 0.3 μm, and the surface roughness of the protrusion is defined as that of lateral surfaces of the protrusion other than the plateau,
- wherein the flat-topped projections comprise metal crystal particles protruding vertically upward from the surface of the metal foil.
2 more elements
Dependencies are inferred from the claim text.