US 7,195,989 B2 · Electrochemical fabrication methods using transfer plating of masks

Abstract

Three-dimensional structures are electrochemically fabricated by depositing a first material onto previously deposited material through voids in a patterned mask where the patterned mask is at least temporarily adhered to a substrate or previously formed layer of material and is formed and patterned onto the substrate via a transfer tool patterned to enable transfer of a desired pattern of precursor masking material. In some embodiments the precursor material is transformed into masking material after transfer to the substrate while in other embodiments the precursor is transformed during or before transfer. In some embodiments layers are formed one on top of another to build up multi-layer structures. In some embodiments the mask material acts as a build material while in other embodiments the mask material is replaced each layer by a different material which may, for example, be conductive or dielectric.

Claims13

Dependent claims

A fabrication process for forming a multi-layer three-dimensional structure, comprising:

(a) forming and adhering a layer of material to a previously formed layer and/or to a substrate;
and
(b) repeating the forming and adhering of (a) a plurality of times to build up a three-dimensional structure from a plurality of adhered layers;
wherein the formation of at least a given layer, comprises:
(1) selectively transferring a pre-patterned precursor of a masking material which is transformed into a solidified masking material of desired thickness and cross-sectional configuration and adhered to the substrate or a previously formed layer to form a mask, wherein the mask has at least one extended region of masking material through which at least one void extends, and wherein the masking material comprises a dielectric;
and
(2) depositing a first material onto a portion of the substrate or previously formed layer through the at least one void in the mask to form a portion of the given layer from a deposited first material;
and
(3) removing the masking material to leave at least one opening which extends through the deposited first material on the given layer;
(4) depositing a second material into the at least one opening through the deposited first material on the given layer to form a portion of the layer from a deposited second material;
and
(5) planarizing the deposited first and second materials to establish a common level for the first and second materials.

9 more elements

Dependencies are inferred from the claim text.

Electrochemical fabrication methods using transfer plating of masks

Life of this patent

Electrochemical fabrication methods using transfer plating of masks

Life of this patent

Abstract

Claims13