Mask and method of manufacturing mask
AssigneeDai Nippon Printing Co., Ltd.
InventorDaisuke KITAYAMA
Life of this patent
Estimating the term…
Abstract
A mask includes a metal layer. The metal layer has a third surface, a fourth surface that is located opposite the third surface, and multiple second openings that extend from the third surface to the fourth surface. The metal layer has an effective region where the multiple second openings are formed and a peripheral region surrounding the effective region. The peripheral region includes a dummy region that is adjacent to the effective region so as to surround the effective region in a circumferential shape. Multiple recessed portions recessed from the fourth surface toward the third surface are formed in the dummy region.
Claims18
A mask comprising:
- a first layer having a first surface, a second surface that is located opposite the first surface, and at least one first opening that extends from the first surface to the second surface;
- and
- a metal layer having a third surface that faces the second surface, a fourth surface that is located opposite the third surface, and multiple second openings that extend from the third surface to the fourth surface and that overlap the at least one first opening in plan view, wherein
- the first layer contains silicon or a silicon compound,
- the metal layer has an effective region where the multiple second openings are formed and a peripheral region surrounding the effective region,
- the peripheral region includes a dummy region that is adjacent to the effective region so as to surround the effective region in a circumferential shape, and multiple recessed portions recessed from the fourth surface toward the third surface are formed in the dummy region.
A method of manufacturing a mask, the method comprising:
- a step of preparing a multilayer body including a first layer having a first surface and a second surface that is located opposite the first surface, and a seed layer having a fifth surface that faces the second surface and a sixth surface that is located opposite the fifth surface;
- a step of providing a first resist layer containing a positive resist on the sixth surface of the seed layer;
- a step of forming multiple resist projections projecting from the sixth surface in a third region and a fourth region surrounding the third region on the sixth surface by exposing and developing the first resist layer;
- a step of performing a first plating process to form a first metal layer having multiple openings corresponding to the multiple resist projections by precipitating metal on the sixth surface, where the multiple resist projections are formed in the third region and the fourth region;
- a step of removing resist projections of the multiple resist projections that are located in the fourth region;
- a step of removing resist projections of the multiple resist projections that are located in the third region;
- a step of partly forming a second resist layer on the first surface of the first layer;
- and
- a step of forming a first opening in the first layer by etching the first layer from the first surface side, wherein
- each of the resist projections that are located in the third region has a tapered surface that narrows inward as a distance from the sixth surface increases.
Dependencies are inferred from the claim text.